36results about How to "Meet the requirements of the occasion" patented technology

The invention discloses a metal-resin composite and a preparation method thereof. The metal is titanium or a titanium alloy; the composite comprises a metal substrate and a resin layer which is attached to at least partial surface of the metal substrate; pits are distributed in the surface of the metal substrate attached with the resin layer; part of resin in the resin layer downwards extends, the pits are filled with the resin, and content of an element oxygen in the surface layer of the metal substrate accounts for more than 1wt%. The preparation method comprises the following steps: soaking the metal substrate into an etching solution comprising at least one alkali metal hydroxide, and forming pits in the surface of the metal substrate; and injecting resin into the surface of the metal substrate subjected to surface treatment to form the resin layer. The binding force between the metal substrate and the resin layer in the metal-resin composite is high, so that the resin layer is not easily dropped from the surface of the metal substrate, and therefore, the metal-resin composite is suitable for being used an electronic product shell. The etching solution used by the preparation method is low in toxicity and is small in volatility, so that the operation safety is high, and the pollution to the environment is small.

The invention, which relates to the technical field of electronic products, provides a simple and high-efficiency relay matrix plate comprising a power supply circuit, a USB interface circuit, a serial port circuit, an MCU circuit, a driving circuit and a relay array. The USB interface circuit and the serial port circuit are connected with the MCU circuit; the MCU circuit is connected with the driving circuit by an SPI IN interface; the driving circuit is respectively connected with an SPI OUT interface and the relay array; the power supply circuit is connected with the USB interface circuit, the serial port circuit, the MCU circuit, the driving circuit and the relay array for power supplying. Compared with the traditional PCI or PXI bus, the provided simple and high-efficiency relay matrix plate has advantages of simple structure, light weight, small size, and capability of independent usage or cascade expansion and the like.

The invention discloses a frequency converter configuration method and a frequency converter configuration system. The frequency converter configuration method comprises the steps of dividing a frequency converter executable file into a basic control software executable file and a function module software executable file; partitioning basic control software executable file memory space, corresponding variable memory space of the basic control software executable file memory space, function module software executable file memory space and corresponding variable memory space of the function module software executable file memory space by a frequency converter control single board memorizer, wherein the basic control software executable file comprises an entry address pointing to the function module software executable file memory space; memorizing the basic control software executable file in corresponding memory space of a frequency converter control single board according to designing; memorizing the function module software executable file in corresponding frequency converter memory space according to purposes, wherein a frequency converter comprises a control single board and power hardware, and the requirements of the method are met by the control single board memorizer. The frequency converter configuration system comprises the frequency converter and a frequency converter manufacturer function module software providing side. The frequency converter configuration method and the frequency converter configuration method, disclosed by the invention, are simple in operation and low in cost, and can meet the using requirements in more occasions.

A simple and highly efficient programmable resistive plate relates to the technical field of electronic products. The resistive plate comprises a USB interface circuit (2) and a serial interface circuit (3), both of which are connected to an MCU circuit (4). The MCU circuit (4) is connected to a drive circuit (5) through an SPI IN interface. The drive circuit (5) is connected to an SPI OUT interface and a relay array (6). The relay array (6) is connected to a resistor array (7). A power supply circuit (1) is connected to the USB interface circuit (2), the serial interface circuit (3), the MCU circuit (4), the drive circuit (5), the relay array (6), and the resistor array (7). Compared with traditional PCI or PXI buses, the resistive plate has the advantages of a simple structure, a light weight and a small size, and the resistive plate can be used individually or used in cascade extension.

The invention discloses a hydrated alumina composition containing a porous silicon aluminum material and a preparation method thereof, a molded body and a preparation method and application thereof, and a producing molding system. The composition contains hydrated alumina, the porous silicon aluminum material and a compound with at least two proton acceptor sites and with the value of phi of 5 orless. The present invention also discloses a hydroisomerization catalyst using the molded body prepared from the hydrated alumina composition as a carrier, a preparation method and a hydroisomerization method. The molded body with higher strength is prepared from hydrated alumina wet gel as a starting material, the step of drying of the hydrated alumina wet gel is omitted, the overall process flowis simplified, the overall operation energy consumption is reduced, dust pollution caused by use of pseudoboehmite dry powder as a raw material is avoided, and the working environment is greatly improved. The catalyst shows a higher catalytic activity in the hydroisomerization reaction.

The invention provides a double-layer-structure mould pressing multi-core-group ceramic capacitor and a production method thereof. The multi-core-group ceramic capacitor comprises a plastic package shell, a frame arranged in the plastic package shell, four capacitor chip modules and an insulating spacer, wherein the frame comprises a first leading-out end, a second leading-out end, a lower welding layer and an upper welding layer, the capacitor chip modules are welded at the upper and lower ends of the upper and lower welding layers, the insulating spacer is arranged between the two adjacent capacitor chip modules to play a role in isolation, and the first and second leading-out ends respectively extend out of the plastic package shell. The multi-core-group ceramic capacitor realizes multi-core-group capacitor lamination in space, greatly increases the capacitance, saves the welding area, and has higher electrical performance and reliability.

The invention discloses a simple and efficient programmable resistance board, which relates to the technical field of an electronic product. A USB (Universal Serial Bus) interface circuit (2) and a serial interface circuit (3) of the simple and efficient programmable resistance board are both connected with an MCU (Micro Controller Unit) circuit (4), the MCU circuit (4) is connected with a driving circuit (5) through an SPI (Serial Peripheral Interface) IN interface, the driving circuit (5) is respectively connected with an SPI OUT interface and a relay array (6), the relay array (6) is connected with a resistance array (7), and a power supply circuit (1) is connected with the USB interface circuit (2), the serial interface circuit (3), the MCU circuit (4), the driving circuit (5), the relay array (6) and the resistance array (7). Compared with a traditional PCI (Peripheral Component Interconnect) or PXI (PCI Extensions for Instrumentation) bus, the simple and efficient programmable resistance board disclosed by the invention has the advantages that the structure is simple, the weight is light, the size is small, independent use or cascade extension can be carried out, and the like.

The invention discloses an embedded packaging structure of an LED (light emitting diode) light source. The embedded packaging structure comprises a bracket, a base and an electrode, wherein the upper surface of the bracket is provided with a light source bowl cup. The embedded packaging structure is characterized in that an LED chip is connected with the electrode in series or in parallel and is arranged on the light source bowl cup, both the bottom of the bracket and the bottom of a base groove of the base matched with the bracket are flat-plate type, and the bracket is tightly adhered to the base. The embedded packaging structure has a simple and compact structure, is easy to manufacture and has the advantages of reasonable heat-dissipating structure and good heat-dissipating effect.

The invention relates to the technical field of hydrocarbon oil hydrogenation, and concretely discloses a hydrogenation protection catalyst, a preparation method and an application thereof, and a hydrocarbon oil hydrotreatment method. The catalyst contains a carrier and hydrogenation active components supported on the carrier, and the carrier is obtained through forming a hydrated alumina composition having a phi value being 1.8-5 and containing hydrated alumina, a compound having at least two proton acceptor sites and an alkali earth metal-containing compound. The invention also discloses thehydrocarbon oil hydrotreatment method using the catalyst. The carrier of the catalyst, having a high strength, is prepared from hydrated alumina wet gel, so the step for drying the hydrated alumina wet gel is omitted, the total process flow is simplified, the total operating energy consumption is reduced, and dust pollution initiated by pseudo-boehmite dry glue powder used as a raw material to prepare the carrier is avoided. The catalyst has a high catalytic activity, and can effectively reduce the content of metal impurities in hydrocarbon oil and prolong the service life of a hydrogenationcatalyst main agent.