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Double-layer-structure mould pressing multi-core-group ceramic capacitor and production method thereof

A ceramic capacitor, double-layer structure technology, applied in the direction of multilayer capacitors, fixed capacitor dielectrics, fixed capacitor terminals, etc., can solve the problems of limited number of product chips, unable to meet customer needs, single type, etc., to achieve mechanical and The effect of strong environmental usability, convenient welding planning and simple production process

Pending Publication Date: 2021-05-14
FUJIAN TORCH ELECTRON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the internal structure of the existing molded multi-core ceramic capacitors is a single-layer or double-layer chip-mount welding structure, which is of a single type. Due to the restriction of the design structure, the maximum number of chips carried by the product is limited, which cannot meet the increasing customer needs.

Method used

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  • Double-layer-structure mould pressing multi-core-group ceramic capacitor and production method thereof
  • Double-layer-structure mould pressing multi-core-group ceramic capacitor and production method thereof
  • Double-layer-structure mould pressing multi-core-group ceramic capacitor and production method thereof

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Embodiment Construction

[0033] like Figure 1 to Figure 3 As shown, the double-layer structure molded multi-core group ceramic capacitor includes a plastic package 1, a frame arranged in the plastic package 1, four capacitor chip modules and an insulating gasket 4, and the frame includes a first lead-out 21, a second lead-out 22. The lower welding layer and the upper welding layer, the first lead-out end 21 and the second lead-out end 22 are arranged at intervals relative to each other, the lower welding layer includes two first welding strips 23 and two second welding strips 24 arranged in a staggered manner and extending horizontally, the two The first welding strip 23 is arranged at intervals on the first lead-out end 21, and the two second welding strips 24 are arranged at intervals on the second lead-out end 22. Two third welding strips 25 and two fourth welding strips 26 are arranged alternately, and all have vertical Section 27 and the horizontal section 28 that is arranged on the vertical sec...

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Abstract

The invention provides a double-layer-structure mould pressing multi-core-group ceramic capacitor and a production method thereof. The multi-core-group ceramic capacitor comprises a plastic package shell, a frame arranged in the plastic package shell, four capacitor chip modules and an insulating spacer, wherein the frame comprises a first leading-out end, a second leading-out end, a lower welding layer and an upper welding layer, the capacitor chip modules are welded at the upper and lower ends of the upper and lower welding layers, the insulating spacer is arranged between the two adjacent capacitor chip modules to play a role in isolation, and the first and second leading-out ends respectively extend out of the plastic package shell. The multi-core-group ceramic capacitor realizes multi-core-group capacitor lamination in space, greatly increases the capacitance, saves the welding area, and has higher electrical performance and reliability.

Description

technical field [0001] The invention relates to a double-layer structure molded multi-core group ceramic capacitor and a production method thereof. Background technique [0002] Ceramic capacitors have the characteristics of small size, large specific volume, long life, high reliability, and suitable for surface mounting, in addition to the characteristics of "blocking direct traffic" of capacitors. With the rapid development of the world's electronics industry, as the basic components of the electronics industry, ceramic capacitors are also developing at an astonishing speed, increasing at a rate of 10% to 15% every year. At present, the demand for ceramic capacitors in the world is more than 200 billion pieces, 70% of which come from Japan, followed by Europe, America and Southeast Asia (including China). With the improvement of the reliability and integration of chip products, its scope of use is wider and wider, and it is widely used in various military and civilian ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/224H01G4/228
CPCH01G4/12H01G4/224H01G4/228H01G4/30
Inventor 朱江滨吴育东吴文辉吴明钊
Owner FUJIAN TORCH ELECTRON TECH CO LTD
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