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Metal-resin composite as well as preparation method thereof and electronic product shell

A technology for electronic products and composites, applied in the field of metal-resin composites and their preparation, can solve problems such as low bonding force, and achieve the effects of strong bonding, high bonding strength and good structural stability

Active Publication Date: 2016-04-27
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The object of the present invention is to overcome the problem of low bonding force between the metal base material and the resin layer existing in the composite body of titanium or titanium alloy and resin, and to provide a metal-resin composite body and its preparation method. There is a high bonding force between the metal substrate and the resin layer in the body

Method used

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  • Metal-resin composite as well as preparation method thereof and electronic product shell
  • Metal-resin composite as well as preparation method thereof and electronic product shell
  • Metal-resin composite as well as preparation method thereof and electronic product shell

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preparation example Construction

[0035] According to a second aspect of the present invention, the present invention provides a method for preparing a metal-resin composite, the metal being titanium or a titanium alloy, the method comprising an etching step and an injection molding step.

[0036] In the etching step, the metal substrate is immersed in an etching solution to form pits on the surface of the metal substrate to obtain a surface-treated metal substrate, and the etching solution contains at least one alkali metal hydroxide.

[0037] According to the method of the present invention, the etching conditions in the etching step make pits formed on the surface of the obtained surface-treated metal substrate, and the pits are densely distributed on the surface of the substrate. The width of the pits may be 10-100000 nm each, preferably 300-30000 nm each; the depth of the pits may be 10-5000 nm each, preferably 100-3000 nm each.

[0038] According to the method of the present invention, the etching condit...

Embodiment 1

[0084] 1. Pretreatment

[0085] Cut a commercially available pure titanium plate with a thickness of 0.8mm into rectangular pieces of 15mm×80mm, put it into a polishing machine for polishing, and then perform degreasing, water washing and drying in sequence.

[0086] 2. Surface treatment

[0087] Put the titanium sheet obtained in step (1) in 500mL etching solution at 25°C for 60 minutes, then take out the titanium sheet, wash it with deionized water for 3 times, then put it in an oven and dry it at 65°C to obtain the surface processed titanium sheet. Wherein, the etching solution is a mixed aqueous solution of sodium hydroxide and boric acid, the concentration of sodium hydroxide is 7 mol / L, and the concentration of boric acid is 0.5 mol / L.

[0088] Observing the surface of the surface-treated titanium sheet with a metallographic microscope, it is determined that densely distributed pits are formed on the surface of the surface-treated titanium sheet, the width of the pits ...

Embodiment 2

[0111] (1) The titanium sheet is pretreated by the same method as in step (1) of Example 1.

[0112] (2) Surface treatment

[0113] Put the titanium sheet obtained in step (1) in 500mL etching solution at 35°C for 30 minutes, then take out the titanium sheet, wash it with deionized water for 3 times, then put it in an oven and dry it at 65°C to obtain the surface processed titanium sheet. Wherein, the etching solution is a mixed aqueous solution of sodium hydroxide and disodium hydrogen phosphate, the concentration of sodium hydroxide is 7 mol / L, and the concentration of disodium hydrogen phosphate is 1 mol / L.

[0114] Observing the surface of the surface-treated titanium sheet with a metallographic microscope, it is determined that densely distributed pits are formed on the surface of the surface-treated titanium sheet, the width of the pits is respectively in the range of 300-30000nm, and the depth is Each in the range of 100-3000 nm. The energy spectrum analysis was carr...

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Abstract

The invention discloses a metal-resin composite and a preparation method thereof. The metal is titanium or a titanium alloy; the composite comprises a metal substrate and a resin layer which is attached to at least partial surface of the metal substrate; pits are distributed in the surface of the metal substrate attached with the resin layer; part of resin in the resin layer downwards extends, the pits are filled with the resin, and content of an element oxygen in the surface layer of the metal substrate accounts for more than 1wt%. The preparation method comprises the following steps: soaking the metal substrate into an etching solution comprising at least one alkali metal hydroxide, and forming pits in the surface of the metal substrate; and injecting resin into the surface of the metal substrate subjected to surface treatment to form the resin layer. The binding force between the metal substrate and the resin layer in the metal-resin composite is high, so that the resin layer is not easily dropped from the surface of the metal substrate, and therefore, the metal-resin composite is suitable for being used an electronic product shell. The etching solution used by the preparation method is low in toxicity and is small in volatility, so that the operation safety is high, and the pollution to the environment is small.

Description

technical field [0001] The invention relates to a metal-resin composite body and a preparation method thereof, and also relates to an electronic product casing. Background technique [0002] Metal-resin integrated molding technology is required in the field of parts manufacturing for automobiles, home appliances, and industrial machines. [0003] At present, the commonly used method of combining titanium and resin is the adhesive method. This method combines titanium and shaped resins with chemical adhesives to form composites. However, in the composite body obtained by this method, the binding force between the titanium material and the resin is poor, and the adhesive bonding layer is not resistant to acid and alkali, which affects the use of the composite body. In addition, since the adhesive bonding layer has a certain thickness, it will affect the size of the final product. [0004] In response to the above-mentioned shortcomings of the adhesive method, researchers ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14C23F1/38H05K5/02
CPCB29C45/14311B29C45/14778B29C2045/14868B29K2705/08B29L2031/34B32B15/08B32B15/20C23F1/38C25D11/26B29C45/14B32B3/30B32B38/10B32B2457/00C25D11/04B29K2105/20
Inventor 章晓陶乐天孙剑陈梁
Owner BYD CO LTD
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