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A metal-resin composite body and its preparation method and an electronic product casing

A technology for electronic products and composites, applied in the field of metal-resin composites and their preparation, can solve problems such as low bonding force, and achieve the effects of strong bonding, good structural stability and high bonding strength

Active Publication Date: 2018-11-09
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The object of the present invention is to overcome the problem of low bonding force between the metal base material and the resin layer existing in the composite body of titanium or titanium alloy and resin, and to provide a metal-resin composite body and its preparation method. There is a high bonding force between the metal substrate and the resin layer in the body

Method used

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  • A metal-resin composite body and its preparation method and an electronic product casing
  • A metal-resin composite body and its preparation method and an electronic product casing
  • A metal-resin composite body and its preparation method and an electronic product casing

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preparation example Construction

[0035] According to the second aspect of the present invention, the present invention provides a method for preparing a metal-resin composite, wherein the metal is titanium or a titanium alloy, and the method includes an etching step and an injection molding step.

[0036] In the etching step, the metal substrate is immersed in an etching solution to form pits on the surface of the metal substrate to obtain a surface-treated metal substrate. The etching solution contains at least one alkali metal hydroxide.

[0037] According to the method of the present invention, the etching conditions in the etching step are such that the surface of the obtained surface-treated metal substrate is formed with pits, and the pits are densely distributed on the surface of the substrate. The width of the pits may each be 10-100000 nm, preferably 300-30000 nm; the depth of the pits may each be 10-5000 nm, preferably 100-3000 nm each.

[0038] According to the method of the present invention, the etching...

Embodiment 1

[0084] 1. Pre-treatment

[0085] A commercially available pure titanium plate with a thickness of 0.8mm is cut into rectangular pieces of 15mm×80mm, which are placed in a polishing machine for grinding and polishing, and then degreasing, washing and drying are carried out in sequence.

[0086] 2. Surface treatment

[0087] The titanium sheet obtained in step (1) was immersed in 500mL etching solution at 25°C for 60 minutes, then the titanium sheet was taken out, washed with deionized water 3 times, and then placed in an oven to dry at 65°C to obtain a surface Treated titanium flakes. Wherein, the etching solution is a mixed aqueous solution of sodium hydroxide and boric acid, the concentration of sodium hydroxide is 7 mol / L, and the concentration of boric acid is 0.5 mol / L.

[0088] A metallurgical microscope was used to observe the surface of the surface-treated titanium sheet, and it was confirmed that the surface of the surface-treated titanium sheet was formed with densely distri...

Embodiment 2

[0111] (1) Use the same method as step (1) of Example 1 to pre-treat the titanium sheet.

[0112] (2) Surface treatment

[0113] The titanium sheet obtained in step (1) was immersed in 500 mL etching solution at 35°C for 30 minutes, then the titanium sheet was taken out, washed with deionized water 3 times, and then placed in an oven to dry at 65°C to obtain a surface Treated titanium flakes. Wherein, the etching solution is a mixed aqueous solution of sodium hydroxide and disodium hydrogen phosphate, the concentration of sodium hydroxide is 7 mol / L, and the concentration of disodium hydrogen phosphate is 1 mol / L.

[0114] A metallurgical microscope was used to observe the surface of the surface-treated titanium sheet, and it was confirmed that the surface of the surface-treated titanium sheet was formed with densely distributed pits. The widths of the pits were in the range of 300-30000 nm. Each is in the range of 100-3000nm. A scanning electron microscope was used to perform ene...

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Abstract

The invention discloses a metal-resin composite body and a preparation method thereof. The metal is titanium or a titanium alloy. The composite body includes a metal base material and a resin layer attached to at least part of the surface of the metal base material. There are pits distributed on the surface of the metal substrate of the layer, part of the resin in the resin layer extends downwards and fills the pits, and the oxygen element content of the surface layer of the metal substrate is more than 1% by weight. The preparation method comprises immersing the metal substrate in an etching solution containing at least one alkali metal hydroxide, forming pits on the surface of the metal substrate; injecting a resin into the surface of the obtained surface-treated metal substrate to obtain A resin layer is formed. In the metal-resin composite of the present invention, the bonding force between the metal substrate and the resin layer is high, the resin layer is not easy to fall off from the surface of the metal substrate, and is suitable for use as an electronic product casing. The etching solution used in the preparation method of the invention has low toxicity and low volatility, high operation safety and little environmental pollution.

Description

Technical field [0001] The invention relates to a metal-resin composite body and a preparation method thereof. The invention also relates to an electronic product housing. Background technique [0002] In the field of parts manufacturing such as automobiles, household appliances, and industrial machines, metal and resin integrated molding technology is required. [0003] At present, the commonly used method of combining titanium and resin is the adhesive method. The method uses a chemical adhesive to bond the titanium material and the molded resin together to obtain a composite body. However, in the composite obtained by this method, the bonding force between the titanium material and the resin is poor, and the adhesive bonding layer is not resistant to acid and alkali, which affects the use of the composite. In addition, since the adhesive bonding layer has a certain thickness, it will affect the size of the final product. [0004] In response to the above-mentioned shortcomings ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14C23F1/38H05K5/02
CPCB29C45/14311B29C45/14778B29C2045/14868B29K2705/08B29L2031/34B32B15/08B32B15/20C23F1/38C25D11/26B29C45/14B32B3/30B32B38/10B32B2457/00C25D11/04B29K2105/20
Inventor 章晓陶乐天孙剑陈梁
Owner BYD CO LTD
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