Polyamideimide cured epoxy resin composite material and preparation method thereof

A technology of polyamide-imide and epoxy resin, which is applied in the field of polyamide-imide (PAI)-cured epoxy resin composite materials and its preparation, and can solve problems such as poor compatibility, low heat resistance, and easy oxidation. problems, to achieve the effect of moderate crosslinking degree, avoiding insufficient toughness and high tensile strength

Inactive Publication Date: 2013-11-27
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned several modification methods have their own shortcomings. Although the rubber elastomer can achieve the purpose of improving the toughness of epoxy resin, the compatibility between rubber and epoxy resin is very poor, and there is unsaturated rubber itself. bond, resulting in varying degrees of reduction in the heat resistance, dimensional stability, upper limit temperature, and oxidation resistance of the modified epoxy resin; although the core-shell polymer toughened modified epoxy resin solves the problem of rubber and Epoxy resin has problems such as poor compatibility, but there are still problems such as low heat resistance and easy oxidation; inorganic nanoparticles can improve the heat resistance and toughness of epoxy resin to a certain extent, but because inorganic nanoparticles are very easy to agglomerate and The compatibility with epoxy resin is relatively poor, so its modification degree to epoxy resin is also very limited; thermoplastic resin has good compatibility with epoxy resin, which can improve the toughness and tensile strength of epoxy resin, At the same time, it will not have much impact on other properties, so this kind of modification method is increasingly attracting the attention of researchers at home and abroad.
[0005] The above-mentioned methods of modifying epoxy resin all add a third substance to the epoxy resin / curing agent system, which increases the complexity and instability of the system, which is not conducive to the development of research and the improvement of performance

Method used

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  • Polyamideimide cured epoxy resin composite material and preparation method thereof
  • Polyamideimide cured epoxy resin composite material and preparation method thereof
  • Polyamideimide cured epoxy resin composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Dissolve 100g of tetraglycidylamine epoxy resin (epoxy value 0.80eq / 100g) in an appropriate amount of N,N'-dimethylacetamide, add 283g of PAI-2 curing agent after fully dissolved, put Put it into a blast oven, pre-cure at 165°C for 1 hour, and cure at 235°C for 3 hours. The tensile strength of the obtained cured product is 113MPa, the initial thermal decomposition temperature is 401°C, the residual carbon is 43.1%, and the limiting oxygen index is 34.7%.

Embodiment 2

[0044] Dissolve 100g of tetraglycidylamine epoxy resin (epoxy value 0.80eq / 100g) in an appropriate amount of N,N'-dimethylacetamide, add 242g of PAI-1 curing agent after fully dissolved, put Put it into a blast oven, pre-cure at 165°C for 1 hour, and cure at 250°C for 3 hours. The tensile strength of the obtained cured product is 106MPa, the initial thermal decomposition temperature is 398°C, the residual carbon is 41.7%, and the limiting oxygen index is 34.2%.

Embodiment 3

[0046] Dissolve 100g of bisphenol A epoxy resin (epoxy value 0.44eq / 100g) in an appropriate amount of N,N'-dimethylacetamide, add 156g of PAI-3 curing agent after fully dissolved, put Pre-cured at 165°C for 1 hour and cured at 224°C for 3 hours in a blast oven. The tensile strength of the cured product was 101MPa, the initial thermal decomposition temperature was 393°C, the residual carbon was 39.9%, and the limiting oxygen index was 33.5%.

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Abstract

Belonging to the technical field of epoxy resin materials, the invention specifically relates to a polyamideimide cured epoxy resin composite material and a preparation method thereof. The composite material of the invention is obtained by employing a curing agent polyamideimide (PAI) or a mixture of polyamideimide and other curing agents to cure epoxy resin. And the proportion of each component in raw materials is determined by a stoichiometric ratio of an epoxy functional group in the epoxy resin to an amide functional group in PAI. The curing agent polyamideimide adopted in the invention is mainly used in curing epoxy resin, and simultaneously can improve the tensile strength, heat resistance as well as flame resistance.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin materials, and in particular relates to a polyamide-imide (PAI) cured epoxy resin composite material and a preparation method thereof. Background technique [0002] Epoxy resin is a kind of thermosetting polymer synthetic material with good adhesion, corrosion resistance, insulation, high strength and other properties. They are widely used in the bonding of various metals and non-metallic materials, the manufacture of corrosion-resistant coatings, electrical insulation materials, FRP / composite materials, etc. It plays an important role in electronics, electricity, machinery manufacturing, chemical anticorrosion, aerospace, shipping and many other industrial fields, and has become an indispensable basic material in the entire industrial field. [0003] Common epoxy resin curing agents are amines and acid anhydrides. When this type of curing agent cures epoxy resin, it often has high crosslink...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/44C08G59/46
Inventor 李同生陈海鸣吕仁国
Owner FUDAN UNIV
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