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Chip positioning device for surface mount device light emitting diode (SMD LED) patch spectrophotometry machine

A technology for positioning devices and spectrometers, applied in sorting, electrical components, circuits, etc., can solve problems such as chips not being sucked up, material dropping, and affecting positioning effects

Inactive Publication Date: 2014-05-14
广东志成华科光电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with the above-mentioned chip positioning device in the prior art is: due to the process of vacuum suction, lowering, and then suction, on the one hand, the chip may not be sucked up and the material will be dropped; on the other hand, a new position may be generated when the chip is picked up. error, thus affecting the positioning effect
[0007] At the same time, the chip positioning device in the above prior art is not suitable for the SMD LED patch spectrometer that sucks the chip from the lower surface and transfers it

Method used

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  • Chip positioning device for surface mount device light emitting diode (SMD LED) patch spectrophotometry machine
  • Chip positioning device for surface mount device light emitting diode (SMD LED) patch spectrophotometry machine
  • Chip positioning device for surface mount device light emitting diode (SMD LED) patch spectrophotometry machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] One of the specific implementations of the chip positioning device of a kind of SMD LED patch spectrometer of the present invention, such as figure 1 and figure 2As shown, it includes a support plate 1 and a first positioning clamp 2, a second positioning clamp 5, a first connecting rod 3, a second connecting rod 6, a hinge mechanism 4 and a driving source 8 arranged on one side of the supporting plate 1; One end of a positioning clip 2 is connected with an end of the first connecting rod 3, and the other end of the first connecting rod 3 is connected with an end of the hinge mechanism 4; one end of the second positioning clip 5 is connected with the second connecting rod 6, and the second The other end of two connecting rods 6 is connected with the other end of hinge mechanism 4, and is drivenly connected with drive source 8; Move closer to position the chip 100 .

[0049] The positioning center in the present invention is when the first positioning clip 2 and the s...

Embodiment 2

[0059] The second embodiment of the chip positioning device of a SMD LED patch spectrometer of the present invention, as image 3 As shown, the main technical solutions of this embodiment are the same as those of Embodiment 1, and the features not explained in this embodiment are explained in Embodiment 1, and will not be repeated here. The difference between this embodiment and Embodiment 1 is that the hinge mechanism 4 includes a rotating shaft 41, a rotating block 42, a first pin sleeve 43 and a second pin sleeve 44, the rotating shaft 41 is arranged on the support plate 1, and the rotating block 42 can move along the rotating shaft 41 Rotate, the other end of the first connecting rod 3 is hingedly connected with one end of the rotating block 42 through the first pin sleeve 43 , and the other end of the second connecting rod 6 is hingedly connected with the other end of the rotating block 42 through the second pin sleeve 44 .

[0060] Specifically, a rotating shaft hole 421...

Embodiment 3

[0066] The third specific embodiment of the chip positioning device of a SMD LED patch spectrometer of the present invention, as Figure 7 As shown, the main technical solutions of this embodiment are the same as those of Embodiment 1, and the features not explained in this embodiment are explained in Embodiment 1, and will not be repeated here. The difference between this embodiment and Embodiment 1 is that an L-shaped bottom plate 12 and a base 13 are arranged below the support plate 1, one end of the L-shaped bottom plate 12 is fixedly connected with the support plate 1, and the other end of the L-shaped bottom plate 12 is connected to the base. 13 fixed connection. This structure is more stable, and also facilitates the fixed connection between the chip positioning device of the SMD LED patch spectrometer and other devices of the SMD LED patch spectrometer.

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PUM

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Abstract

The invention relates to a chip positioning device for a surface mount device light emitting diode (SMD LED) patch spectrophotometry machine, which comprises a support plate, a first positioning clamp, a second positioning clamp, a first connecting rod, a second connecting rod, a hinge mechanism and a driving source, wherein the first positioning clamp, the second positioning clamp, the first connecting rod, the second connecting rod, the hinge mechanism and the driving source are arranged at one side of the support plate, one end of the first positioning clamp is connected with one end of the first connecting rod, the other end of the first connecting rod is connected with one end of the hinge mechanism, one end of the second positioning clamp is connected with the second connecting rod, the other end of the second connecting rod is connected with the other end of the hinge mechanism and is in driving connection with the driving source, and the first positioning clamp and the second positioning clamp respectively go close to the positioning center under the effect of the driving source and the hinge mechanism for carrying out the position positioning on a chip. The first positioning clamp and the second positioning clamp simultaneously go close to the positioning center by using the hinge mechanism for forming the clamping action, the chip positioned at the inner side is moved towards the positioning center, and the chip positioning device has the characteristics that the positioning is accurate, the cost is low, the control is convenient, the action time is short, and in addition, the chip position error can be reduced.

Description

technical field [0001] The invention relates to the technical field of LED spectrometers, in particular to a chip positioning device for an SMD LED patch spectrometer. Background technique [0002] SMD LED is a new type of surface-mounted semiconductor light-emitting device, which has the advantages of small size, large scattering angle, good uniformity of light emission, and high reliability. The light-emitting colors include various colors including white light. Therefore, it is widely used in various electronic products such as display screens, LCD panel backlights, decorative lighting, and general lighting. [0003] Because the LED packaging must be processed by color separation and light separation before leaving the factory, the LEDs are divided into many bins and categories according to parameters such as wavelength, brightness and operating voltage, and then the LEDs are automatically divided into different Bin tubes according to the set test standards. [0004] LED...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B07C5/02H01L33/00H01L21/68
Inventor 吴涛李斌秦小平
Owner 广东志成华科光电设备有限公司