Production method of tungsten-titanium target blank

Abstract

The invention relates to a production method of a tungsten-titanium target blank. The production method comprises the following steps of: firstly, providing tungsten-titanium powder; secondly, putting the tungsten-titanium powder into a vacuum sheath and vacuumizing; thirdly, carrying out sinter molding by using a hot isostatic pressing technology; and after the sinter molding is completed, cooling and taking out the tungsten-titanium target blank by removing the vacuum sheath. With the adoption of the production method of the tungsten-titanium target blank, provided by the invention, a die is avoided being used; meanwhile, compared with the tungsten-titanium target blank which is prepared by hot-pressing, the tungsten-titanium target blank which is prepared by adopting the production method has the advantages of better density and uniformity of the internal organization structure.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for manufacturing a tungsten-titanium target blank. Background technique [0002] Vacuum sputtering is that the plasma generated by rare gas under abnormal glow discharge conditions bombards the surface of the target under the action of an electric field, sputtering molecules, atoms, ions and electrons on the surface of the target, and the sputtered The particles have a certain kinetic energy and shoot toward the surface of the substrate in a certain direction to form a coating. [0003] Tungsten-titanium target blanks are often used in the vacuum sputtering process. Early tungsten-titanium target blanks were obtained by melting and casting. However, since the melting point of tungsten and titanium are very different, they are 3400 ° C and 1660 ° C respectively, and the specific gravity of the two is also very different, respectively 19.35 g / per cubic centi...

AI Technical Summary

Problems solved by technology

[0007] The problem to be solved by the present invention is to propose a new manufacturing method of tungsten-titanium target blanks, in order to solve the existing hot pressing process, due to the need to design a matching mold according to the size of the tungsten-titanium target blanks, and the mold It is relatively expensive and easy to wear, and the uniformity of the internal structure of the tungsten-titanium target blank processed by this method cannot meet the increasingly demanding sputtering process.

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