Manufacturing method of four-layer copper-based metal plate
A technology of base metal plate and copper substrate, which is applied in circuit substrate materials, printed circuit manufacturing, electrical components, etc., can solve the problems of easy bed, no stress on copper clad laminates, easy replacement reaction between copper base and silver, etc. Uniformity, improve the stability of expansion and shrinkage, and enhance the effect of adhesion
Active Publication Date: 2012-03-28
KINWONG ELECTRONICS TECH LONGCHUAN
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Problems solved by technology
[0010] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a method for manufacturing a four-layer copper-based metal plate, aiming at solving the problems of the copper-clad laminates being prone to resting due to stress, copper-based and Silver is prone to problems such as substitution reactions
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[0026] The present invention provides a production method of a four-layer copper-based metal plate. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0027] see figure 1 , which is a schematic diagram of the layered structure of the four-layer copper-based metal plate of the present invention. As shown in the figure, the four-layer copper-based metal plate includes a first layer of copper foil L1, a second layer of copper foil L2, a third layer of copper foil L3 and a fourth layer of copper foil L4 arranged from top to bottom (in the figure , L2 and L3 are pressed together and represented by L2 / L3); a prepreg PP is arranged between the copper foils, and the fourth layer of copper L4 foil is connected to t...
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Abstract
The invention discloses a production method of a four-layer copper-based metal plate. The method comprises the following steps: pressing a second layer copper foil and a third layer copper foil together to form an inner plate, carrying out boring, copper deposition, electroplating and etching treatments on the inner plate in order, pressing a first layer copper foil, the inner plate and a fourth layer copper foil together, and carrying out filling pressing on a cut copper substrate and the fourth layer copper foil. Thus, an unstressed collapsing problem of a copper-clad plate at a copper substrate hollow position in pressing is solved, uniformity of a prepreg at a pressing position is improved, extending and shrinking stability of the four-layer copper-based metal plate is raised, adhesive attraction between the copper foils and the copper substrate is enhanced, and the four-layer copper-based metal plate has strong market competitiveness.
Description
technical field [0001] The invention relates to the field of metal-based PCB boards, in particular to a method for manufacturing a four-layer copper-based metal board. Background technique [0002] Copper-based metal plate is a metal-based copper-clad laminate with good heat dissipation function. It consists of a unique three-layer structure, which is a conductive layer, an insulating layer and a copper-based layer. Copper-based metal plate is a special PCB board, which is widely used in power amplifier devices of high-power and high-frequency equipment such as optoelectronics, power supplies, and automotive electrical modules due to its good heat dissipation and low energy consumption. [0003] Copper-based metal plates are generally multi-layer copper-based metal plates, among which four-layer copper-based metal plates are widely used. However, due to the high difficulty of making this type of special PCB board, there are very few domestic manufacturers. Take the grooved ...
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IPC IPC(8): H05K3/00H05K1/05
Inventor 柯勇王远陈金梅
Owner KINWONG ELECTRONICS TECH LONGCHUAN