Three-layer layered flexible board and its manufacturing method
A manufacturing method and flexible board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit stress/deformation reduction, etc., can solve problems such as low product yield, asymmetrical layout structure, and different thermal expansion coefficients. Improvement of yield rate, improvement of operability, and improvement of expansion and shrinkage stability
Active Publication Date: 2021-04-06
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for manufacturing a three-layer layered flexible board, which aims to solve the problem of product yield caused by asymmetrical layout structure or different thermal expansion coefficients between materials in the manufacturing method of three-layer layered flexible board in the prior art lower technical issues
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[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0033] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element...
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The invention belongs to the technical field of circuit boards, and in particular relates to a three-layer layered soft board and a manufacturing method thereof. The manufacturing method includes the following steps: providing two single-sided boards, a double-sided soft board, a prepreg and an inner layer covering film, and the outer layer of the single board The first layer is a copper layer, the top layer of the double-sided flexible board is a copper layer, the bottom layer is a false copper layer, and the false copper layer is provided with an auxiliary copper laying pattern; a drill is performed to drill the alignment hole of the inner layer pattern of the double-sided flexible board At the same time, uncover the pre-opened window area of the prepreg; make the inner layer circuit; paste the inner layer cover film; press to form a pressed part; secondary drilling, drilling through holes ; Make the outer graphic circuit; paste the outer cover film, and make a three-layer layered soft board through the post-process. Use a double-sided copper-clad flexible board instead of a single-sided copper foil. When making the inner layer pattern, in addition to making the inner layer circuit, the auxiliary copper in the waste area on the back of the pattern circuit is also retained. The retained auxiliary copper increases the hardness of the board. It can effectively improve the expansion and contraction stability of the inner board.
Description
technical field [0001] The invention belongs to the technical field of circuit boards, in particular to a three-layer laminated soft board and a manufacturing method thereof. Background technique [0002] In the production of rigid-flex boards, it is often necessary to make three-layer layered soft boards. The common methods are: first, a double-sided soft board and a single-sided soft board. The structure is asymmetric , the expansion and contraction and deformation are large, which is not conducive to the control of the process; the second type is a combination of a double-sided flexible board and a copper foil. This structure also has asymmetry, and the expansion and contraction and deformation are large, which is not conducive to the control of the process. Control; the third type is a combination of three single-sided flexible boards. Although the cost is high, the structure is symmetrical, which is conducive to the control of the process. [0003] In the third method,...
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IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0271H05K3/4644H05K2203/0214
Inventor 曾志坚路怀璞郑泽红
Owner SHENZHEN KINWONG ELECTRONICS