Welding method of target material and back plate and target material component formed thereby
A welding method and target material technology, applied in welding equipment, electron beam welding equipment, metal material coating technology, etc., can solve the problems of high hardware requirements, export restrictions, etc., and achieve the effect of reducing costs
Active Publication Date: 2015-07-08
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology
[0007] The problem to be solved by the present invention is to propose a new welding method of the target and the back plate, so as to solve the problems in the prior art that the brazed target assembly has outlet restrictions and the implementation of hot isostatic welding requires high hardware requirements
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[0031] In the present invention, first, a plurality of dovetail grooves are formed on the back of the target, and a plurality of dovetail-shaped protrusions matching the dovetail grooves are formed on the front of the back plate; Then, the central area of the target and the back plate is processed by static pressure, and the edge joint area of the target and the back plate is welded by electron beams; the brazing method used in the prior art is avoided, and it is necessary to use Solder, which reduces the cost, and the formed target assembly does not use solder, so the export will not be affected by solder restrictions, and the purpose of environmental protection is achieved. At the same time, hot isostatic welding with high requirements for realization conditions is avoided, and the process is simple easy to operate.
[0032] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present in...
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The invention discloses a welding method of a target material and a back plate, and the method comprises the following steps of: forming multiple dovetail grooves on the back surface of the target material; forming multiple dovetail-shaped bulges matched with the dovetail grooves on the front surface of the back plate; overlapping the target material and the back plate, and occluding the dovetail-shaped bulges with the dovetail grooves; processing the center areas of the target material and the back plate by a static pressure method; and welding the edge combining area of the target material and the back plate by use of an electron beam. The invention also provides a target material component which comprises the target material and the back plate, wherein multiple dovetail grooves are formed on the back surface of the target material; and multiple dovetail-shaped bulges matched with the dovetail grooves are formed on the front surface of the back plate. By adopting the technical scheme of the invention, the adoption of solder for the brazing method in the prior art can be avoided, the cost is lowered, the export of the formed target material component is not influenced by the restriction of solder, and the aim of environmental conservation is achieved; and meanwhile, the hot isostatic pressing with relatively high requirements on the implementation conditions is avoided, and the technology is simple and easy to operate.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a welding method of a target and a back plate and a formed target assembly. Background technique [0002] In the semiconductor industry, a target assembly is composed of a target that meets the sputtering performance and a back plate that is combined with the target and has a certain strength. The back plate can play a supporting role when the target assembly is assembled into the sputtering machine, and has the effect of conducting heat. In the manufacture of large-scale integrated circuits, aluminum targets are often used for physical vapor deposition (PVD) coating to form barrier layers. Magnetron sputtering is used for aluminum targets in the sputtering process, which usually has high strength, high thermal conductivity and high electrical conductivity. The aluminum material is used as the back plate material, but the aluminum target and the back plate material mus...
Claims
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IPC IPC(8): B23K28/02B23K15/06C23C14/34
Inventor 姚力军潘杰王学泽郑文翔
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD