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Control wafer and forming method thereof

A wafer and graphic technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of easy changes, inaccurate machine performance detection, etc., and achieve the effect of preventing changes

Active Publication Date: 2012-05-02
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The wafer control chip formed by the prior art method, after the wafer control chip has been used for many times, the graphics on the wafer control chip are prone to change, resulting in inaccurate detection of the working performance of the machine
[0007] There are many patent application documents about wafer control in the prior art, for example, the publication No. CN101491885A published on July 29, 2009, "a grinding method for wafer control", however, none of them solve the above technology question

Method used

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  • Control wafer and forming method thereof

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Embodiment Construction

[0036] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0037] In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described here, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the present invention is not limited to the specific embodiments disclosed below.

[0038] The inventors have found that the wafer control chip of the prior art is directly exposed to the outside because the graphics on the wafer control chip are directly exposed to the outside world, so that the wafer control chip will be affected by various external factors after being u...

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Abstract

The invention relates to a control wafer and a forming method thereof. The method comprises the following steps: providing a wafer; patterning the wafer to form a pattern on the wafer, wherein the bottom of the pattern is exposed out of the wafer; and forming a transparent protective layer to cover the patterned wafer. The transparent protective layer can achieve the function of protecting the patterned wafer below, and can be used for preventing the pattern on the patterned wafer from changing; and since the protective layer is transparent, the pattern on the patterned wafer can not become unclear.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer controller and a forming method thereof. Background technique [0002] Semiconductor devices are formed on the surface of wafers. With the rapid development of semiconductor manufacturing technology, the demand for wafers is also increasing. Since the wafer is drawn from silica sand, the manufacturing process is quite complicated and time-consuming, so the cost of the wafer is high. [0003] In the prior art, when forming a semiconductor device, it is necessary to go through multiple process steps on the surface of the wafer. If the adjustment and control of any one of the process steps is improper, it will cause quality problems in the formed semiconductor device, resulting in the scrapping of the wafer. Therefore, in the actual production line, whenever the parameters of a process step are adjusted, the process step is used to test the monitor wafer, and the te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/027
Inventor 陈蕾鲍晔胡林周孟兴
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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