Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Light-emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, which is applied in the direction of light sources, electric light sources, lighting devices, etc., and can solve problems such as changes

Inactive Publication Date: 2012-06-06
SHENZHEN SHINESKY OPTOELECTRONICS CO LTD
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for lighting applications, there are specific industry specifications, such as light field distribution, color temperature, and color rendering, which are all important light source quality parameters, because the luminous intensity of LEDs will gradually decay with time, and Most of the current LED lighting applications still need to use blue light diodes to excite phosphors, which form multi-wavelength broadband light after mixing to improve color rendering, making the color temperature often change due to the increase in usage time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The present invention will be further described in detail below with reference to the accompanying drawings.

[0047] see figure 1 , which is a cross-sectional view of the light emitting diode package structure 100 according to the first embodiment of the present invention. The LED package structure 100 includes a LED chip 50 , a color sensing element 70 , a transparent insulating layer 60 connecting the LED chip 50 and the color sensing element 70 , a reflective cup 80 , and an encapsulant 90 . The light emitted by the light emitting diode chip 50 is detected by the color sensing element 70 through the transparent insulating layer 60 .

[0048] The light-emitting diode chip 50 is a flip-chip light-emitting diode chip in this embodiment. The light-emitting diode chip 50 includes a substrate 51 , a light-emitting structure 53 , a first electrode 58 , and a second electrode 59 . A buffer layer 52 is grown between the substrate 51 and the light emitting structure 53 , a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a light-emitting diode packaging structure. The light-emitting diode packaging structure comprises at least one light-emitting diode chip, at least one color sensing component and reflecting cups surrounding the light-emitting diode chip, wherein the light-emitting diode chip is provided with a primary light-emergent surface and a secondary light-emergent surface opposite to the primary light-emergent surface; and the light intensity of light emitted from the secondary light-emergent surface of the light-emitting diode chip is detected by the color sensing component so as to monitor and adjust the color temperature of the light-emitting diode. According to the light-emitting diode, due to the arrangement of the color sensing component, the change of the light intensities of all colors is detected by the color sensing component so as to stabilize the color temperature of the light-emitting diode chip.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure, in particular to a light-emitting diode packaging structure with stable color temperature. Background technique [0002] With the continuous improvement of the luminous efficiency of light-emitting diodes, in addition to the existing applications in indicator lights, traffic lights, LED displays, automotive dashboards and interior lighting, they have also been widely used in the backlight of LCD flat panel displays. After further improving the efficiency in the future, it will be widely used in general lighting. [0003] Of course, for lighting applications, there are specific industry specifications, such as light field distribution, color temperature, and color rendering, which are all important light source quality parameters. Most of the current LED lighting applications still require the use of blue light diodes to excite phosphors, and after mixing, light with a multi-wavelengt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/58H01L33/46H05B37/02
CPCH01L2224/16H01L2224/48091H01L2224/49107H01L2224/73265
Inventor 曾坚信
Owner SHENZHEN SHINESKY OPTOELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com