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Circuit board and manufacturing method thereof

A production method and circuit board technology, which is applied in the direction of multilayer circuit manufacturing, printed circuit, electrical components, etc., to achieve the effect of improving joint reliability, avoiding the problem of residual glue, and reducing the thickness of assembly

Inactive Publication Date: 2012-06-06
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0043] Figure 1A to Figure 1G It is a schematic cross-sectional flow diagram of a method for manufacturing a circuit board according to an embodiment of the present invention. Please refer to Figure 1A , The manufacturing method of the circuit board of this embodiment includes the following steps. First, a base layer 110a is provided, wherein the base layer 110a has a first surface 111 and a second surface 113 opposite to each other, and the base layer 110a is, for example, a core dielectric layer.

[0044] Next, please refer to Figure 1A , respectively forming the first core circuit layer 112a and the second core circuit layer 114a on the first surface 111 and the second surface 113 of the core dielectric layer (ie, the base layer 110a ).

[0045] Next, please refer to Figure 1B , sequentially perform a drilling process and an electroplating filling process to form at least one conductive via structure 116 connecting the first surface 111 and the second surface 113 ( ...

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Abstract

The invention provides a circuit board and a manufacturing method thereof. The method comprises the following steps of: providing a base layer, wherein a first patterning line layer, a second patterning line layer and at least one conductive through hole structure connected with the first patterning line layer and the second patterning line layer are formed on the base layer; configuring at least one protection film on the base layer, wherein the first patterning line layer is partly covered by the protection film; laminating a first added layer line structure onto the protection film and part of the first patterning line layer, wherein the first added layer line structure is provided with at least one pre-removed block, and the pre-removed block is arranged, corresponding to the protection film; laminating a second added layer line structure onto the second patterning line layer; removing the pre-removed block to form at least one notch capable of ensuring the protection film to be exposed out; and removing the protection film to expose part of the first patterning line layer positioned below the protection film.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board capable of providing electronic components and a manufacturing method thereof. Background technique [0002] A circuit board is an important component required by many electronic devices. The circuit board can be assembled with a plurality of electronic components, such as chips and passive components. Through the circuit board, these electronic components are electrically connected to each other, and signals can be transmitted between these electronic components. In this way, these electronic components can function. Therefore, circuit boards are important components of electronic devices. [0003] Due to the market's demand for electronic products that are thin, light, compact and easy to carry, the assembly thickness of electronic components and circuit boards in electronic products will develop in the direction of thinning. For example,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/00
Inventor 张振铨吴明豪张宏麟宋尚霖
Owner UNIMICRON TECH CORP
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