31results about How to "Solve the problem of residual glue" patented technology

The invention discloses a dispensing and assembling apparatus, comprising a dispensing module, a frictioning module and a table top, wherein the dispensing module is provided with a needle head. The dispensing module moves onto the frictioning module, and the frictioning module wipes the needle head of the dispensing module; and the dispensing module and the frictioning module are located on the table top. According to the invention, as the dispensing module moves onto the frictioning module and the frictioning module wipes the needle head of the dispensing module, so the problem of residual gum is overcome; and a shooting module arranged on the apparatus is used for shooting the images of a product, which is beneficial for more accurate dispensing and assembling.

The invention discloses a glue wiping machine, which comprises a material belt, a feeding mechanism, a material receiving mechanism and a base. The belt is in contact with the parts to be wiped, and the material belt is recovered by the described material receiving mechanism after being wiped. The described feeding mechanism and the material receiving mechanism are arranged on the described base. The material mechanism can make the material tape closely contact with the parts to be wiped. At this time, the glue of the parts in contact is wiped clean, so as to solve the problem of residual glue.

The present invention relates to the technical field of manufacturing methods of printed boards, and more particularly, to a method for processing through grooves of rigid-flexible boards. A method for processing a through-groove of a rigid-flexible board, which includes the following steps, S1. For the No-flow prepreg through-groove, a bridge point is set on a sub-core board corresponding to a region other than the outline line of the flexible area, and on the sub-core board Between the spacer and the other positions except the bridge point, open the groove; S2. Place the No-flow prepreg and the sub-core board on the mother core board in sequence, and then perform riveting; S3. Place the riveted rigid-flex board Perform hot pressing in the laminator to form a rigid-flex board; S4. After lamination, place the board in the laminating machine, and break the bridge, and leave the other positions untouched. In the present invention, when the sub-core board of the rigid-flexible board passes through the groove, the gasket is connected with the edge of the groove through the form of bridge points, and the bridge at this position is broken by using a drilling machine after lamination, and the gasket naturally falls off. Solve the problem of adhesive tape residue on the edge of the groove, and simplify the production of gaskets at the same time.

The invention provides an adhesive and a preparation method thereof, an adhesive layer prepared therefrom, and a heat-releasing adhesive tape. The raw materials for the preparation of the adhesive include: hard monomers, soft monomers, functional monomers body, solvent, initiator, curing agent and foamed microspheres. The adhesive of the present invention is polymerized by selecting specific monomers, which effectively improves the high temperature resistance of the adhesive layer, and secondly, creatively introduces foamed microspheres into the raw materials for preparation, so that when the obtained adhesive After the adhesive layer is compounded with the substrate layer, the heavy release layer and the light release layer, a high temperature resistant thermal adhesive tape can be obtained. The high temperature resistant thermal adhesive tape can make the adhesive The adhesive layer and the object to be pasted are separated by the expansion of the microspheres, which fundamentally solves the problem of residual adhesive; and, at a specific temperature, the stripping process used for tape loss becomes simpler, That is to say, the purpose of reducing processing procedures and improving production efficiency is achieved.

The invention provides a release film, a protective film and a display device. The release film comprises a release substrate layer and a release layer, wherein the release layer is arranged on the surface of the release substrate layer, one release layer surface far from the release substrate layer is provided with a plurality of extruding particles, which extrude from one surface of the release layer. The surface of the release layer has extruding particles, and when the release film is applied in the protection film, the extruding particles can cause gaps between the release layer and an adhesive layer, the gaps can be convenient for hot air flow, thus shortening the curing time of the adhesive layer, curing the adhesive layer rapidly, and avoiding the problem of adhesive residue. Also, the performance of the protective film can be more stable.

The invention discloses a soft PVC adhesive tape / protective film, which comprises a PVC film base material and an acrylic pressure-sensitive adhesive coated on the surface of the PVC film base material, and the soft PVC film base material is composed of: PVC resin / vinyl chloride resin / plasticizer=80~90 / 10~20 / 30~60 (weight ratio), the glass transition temperature of the pressure-sensitive adhesive is -30~-10°C, and the number average molecular weight is 60000~250000, The molecular weight distribution is 2.0-10.0, and the acid value is 5-30 mgKOH / g. The soft PVC adhesive tape / protective film of the present invention, through the improvement of the manufacturing formula of the PVC film substrate, uses the plasticizer-resistant pressure-sensitive adhesive at the same time, under the one-step coating process, saves the primer process, and solves the problem of the plasticizer-resistant agent. The bonding force between the pressure-sensitive adhesive and the substrate prevents the damage of the adhesive / base interface over time, effectively prevents the migration of the plasticizer, and solves the problem of residual glue when the PVC tape and PVC protective film are peeled off.

The invention relates to a process method of an asymmetric multilayer rigid-flex board with an air cavity. The process method first prepares double-sided copper-clad laminates, single-sided copper-clad laminates and pure glue, and then prepares the prepared double-sided copper-clad laminates. The upper and lower sides of the multilayer flexible board are stacked with pure rubber and single-sided copper clad laminates in turn to form a multilayer flexible board; then the prepared PP1 and The first copper foil, and a PI protective film is stacked on the outer surface of the first copper foil in the low-level rigid plate area, and the second pressing is performed; then the prepared PP2 is sequentially stacked on the upper and lower sides of the prepared plate. And the second copper foil, carry out the third pressing, after the pressing, carry out CO2 laser controlled deep opening, and after uncovering and forming, perform OSP surface treatment to obtain the finished board. The process method of the asymmetric multi-layer rigid-flex board with air cavity of the present invention has the advantages of good quality, high efficiency and the like.

The invention discloses a method for preparing longitudinal heterojunctions of single-layer transition metal chalcogenides by no-glue transfer. Firstly, fused salt is mixed with transition metal oxide powder as an evaporation source; and transition metal chalcogenides are prepared through growth of the fused salt assisted by a chemical vapor deposition method. Then, de-ionized water is used, and is contacted with the transition metal chalcogenides; the transition metal chalcogenides can float along with water; through flowing of the water, the transition metal chalcogenides are transferred to any target substrate; and the longitudinal heterojunctions and multiple layers of stacked longitudinal heterojunctions are prepared through multiple times of transfer of the transition metal chalcogenides. Any organic glue is not used as a middle auxiliary layer, so that the problem of glue remaining can be solved; and any corrosive solution cannot be used, so that the destruction and the doping of the corrosive solution to the transition metal chalcogenides can be prevented, a new method is provided for transfer of the transition metal chalcogenides and preparation of the longitudinal heterojunctions thereof, and the important significance on acceleration of the research and the application of the transition metal chalcogenides and the longitudinal heterojunctions thereof is achieved.