A kind of adhesive and preparation method thereof, adhesive layer and heat-releasing adhesive tape prepared therefrom

An adhesive layer and adhesive technology, applied in the directions of adhesive additives, adhesives, non-polymer adhesive additives, etc., can solve problems such as inability to withstand temperature, solve the problem of residual glue and improve high temperature resistance , the effect of reducing the processing process

Active Publication Date: 2021-08-10
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this invention can only withstand the temperature below 120-160℃, and cannot withstand higher temperature

Method used

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  • A kind of adhesive and preparation method thereof, adhesive layer and heat-releasing adhesive tape prepared therefrom
  • A kind of adhesive and preparation method thereof, adhesive layer and heat-releasing adhesive tape prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] This embodiment provides an adhesive and a preparation method thereof.

[0061] Wherein, the raw materials for the preparation of the adhesive include the following components based on the total mass of 100%: 3% methyl methacrylate (hard monomer), 26% isooctyl acrylate (soft monomer), acrylic acid Butyl 4% (soft monomer), methacrylic acid 3% (functional monomer), 2-hydroxyethyl acrylate 3% (functional monomer), acrylamide 1% (functional monomer), toluene 12%, Ethyl acetate 43.85%, AIBN 0.2%, toluene diisocyanate 1.5%, m-xylylenediamine epoxy resin 0.05%, foaming microspheres 2.4% (initial foaming temperature is 210°C).

[0062] The preparation method is as follows:

[0063] 1) Mix methyl methacrylate, isooctyl acrylate, butyl acrylate, methacrylic acid, 2-hydroxyethyl acrylate, acrylamide, toluene and ethyl acetate at 20°C and heat up to 73°C within 1h ℃, add AIBN, mix for 2 hours, raise the temperature to 80 ℃ for 1 hour, and cool the obtained reactant to 20 ℃ to obt...

Embodiment 2

[0066] This embodiment provides an adhesive and a preparation method thereof.

[0067] Wherein, the raw materials for the preparation of the adhesive include the following components based on the total mass of 100%: 2% methyl methacrylate, 3% n-butyl methacrylate (hard monomer), isooctyl acrylate 15% (soft monomer), ethyl acrylate 15% (soft monomer), acrylic acid 2% (functional monomer), 2-hydroxyethyl acrylate 2% (functional monomer), acrylamide 4% (functional monomer body), toluene 10%, ethyl acetate 45%, AIBN 0.8%, toluene diisocyanate 0.1%, m-xylylenediamine epoxy resin 0.1%, foaming microspheres 1% (initial foaming temperature is 210°C) .

[0068] The preparation method is as follows:

[0069] 1) Mix methyl methacrylate, n-butyl methacrylate, isooctyl acrylate, ethyl acrylate, acrylic acid, 2-hydroxyethyl acrylate, acrylamide, toluene and ethyl acetate at 25°C, Raise the temperature to 75°C within 1h, add AIBN, mix for 2h, raise the temperature to 85°C and react for 1h...

Embodiment 3

[0072] This embodiment provides an adhesive and a preparation method thereof.

[0073] Wherein, the raw materials for the preparation of the adhesive include the following components based on the total mass of 100%: 2% methyl methacrylate, 2% ethyl methacrylate (hard monomer), 30% ethyl acrylate (soft monomer), butyl acrylate 5% (soft monomer), acrylic acid 1% (functional monomer), 2-hydroxyethyl acrylate 2% (functional monomer), acrylamide 2% (functional monomer) , toluene 16%, ethyl acetate 34.5%, dibenzoyl peroxide 0.5%, toluene diisocyanate 1%, hexamethylene diisocyanate 1%, foaming microspheres 3% (initial foaming temperature is 210 ° C ).

[0074] The preparation method is as follows:

[0075] 1) Mix methyl methacrylate, ethyl methacrylate, ethyl acrylate, butyl acrylate, acrylic acid, 2-hydroxyethyl acrylate, acrylamide, toluene and ethyl acetate at 25°C, within 1h Raise the temperature to 75°C, add dibenzoyl peroxide, mix for 2 hours, raise the temperature to 85°C f...

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Abstract

The invention provides an adhesive and a preparation method thereof, an adhesive layer prepared therefrom, and a heat-releasing adhesive tape. The raw materials for the preparation of the adhesive include: hard monomers, soft monomers, functional monomers body, solvent, initiator, curing agent and foamed microspheres. The adhesive of the present invention is polymerized by selecting specific monomers, which effectively improves the high temperature resistance of the adhesive layer, and secondly, creatively introduces foamed microspheres into the raw materials for preparation, so that when the obtained adhesive After the adhesive layer is compounded with the substrate layer, the heavy release layer and the light release layer, a high temperature resistant thermal adhesive tape can be obtained. The high temperature resistant thermal adhesive tape can make the adhesive The adhesive layer and the object to be pasted are separated by the expansion of the microspheres, which fundamentally solves the problem of residual adhesive; and, at a specific temperature, the stripping process used for tape loss becomes simpler, That is to say, the purpose of reducing processing procedures and improving production efficiency is achieved.

Description

technical field [0001] The invention relates to the technical field of functional adhesive tapes, in particular to an adhesive, a preparation method thereof, an adhesive layer prepared therefrom, and a heat-adhesive adhesive tape. Background technique [0002] In the semiconductor manufacturing process, when cutting and polishing semiconductor wafers, in order to reduce the defect density of silicon thin layers, wafer cutting and adhesion-reducing protective films are often used. In the prior art, a high-temperature-resistant protective film is used as a bearing, and after a specific temperature, the protective film is peeled off. Due to long-term high-temperature conditions, the traditional high-temperature protective film will have the risk of residual glue, and the viscosity will increase after a long time, making it difficult to peel off later. [0003] CN107163869A discloses a heat-adhesive adhesive tape and a preparation method thereof, comprising a release film layer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J163/00C09J11/06C08F220/18C08F220/14C08F220/06C08F220/20C08F220/56C08J9/32C09J7/30
CPCC08F220/18C08J9/32C08J2203/22C08J2333/26C09J11/06C09J133/26C09J2433/00C09J7/30C09J2301/30C08L63/00C08K5/29
Inventor 李阜阳韩晓航刘源陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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