Adhesive and preparation method thereof, and adhesive layer and heat-reducing adhesive tape prepared from adhesive

An adhesive layer and adhesive technology, applied in the directions of adhesive additives, adhesives, non-polymer adhesive additives, etc., can solve problems such as unbearable temperature, solve the problem of residual glue, and simple stripping process , the effect of improving high temperature resistance

Active Publication Date: 2020-03-31
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this invention can only withstand the temperature below 120-160℃, and cannot withstand higher temperature

Method used

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  • Adhesive and preparation method thereof, and adhesive layer and heat-reducing adhesive tape prepared from adhesive
  • Adhesive and preparation method thereof, and adhesive layer and heat-reducing adhesive tape prepared from adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] This embodiment provides an adhesive and a preparation method thereof.

[0061] Wherein, the raw materials for the preparation of the adhesive include the following components based on the total mass of 100%: 3% methyl methacrylate (hard monomer), 26% isooctyl acrylate (soft monomer), acrylic acid Butyl 4% (soft monomer), methacrylic acid 3% (functional monomer), 2-hydroxyethyl acrylate 3% (functional monomer), acrylamide 1% (functional monomer), toluene 12%, Ethyl acetate 43.85%, AIBN 0.2%, toluene diisocyanate 1.5%, m-xylylenediamine epoxy resin 0.05%, foaming microspheres 2.4% (initial foaming temperature is 210°C).

[0062] The preparation method is as follows:

[0063] 1) Mix methyl methacrylate, isooctyl acrylate, butyl acrylate, methacrylic acid, 2-hydroxyethyl acrylate, acrylamide, toluene and ethyl acetate at 20°C and heat up to 73°C within 1h ℃, add AIBN, mix for 2 hours, raise the temperature to 80 ℃ for 1 hour, and cool the obtained reactant to 20 ℃ to obt...

Embodiment 2

[0066] This embodiment provides an adhesive and a preparation method thereof.

[0067] Wherein, the raw materials for the preparation of the adhesive include the following components based on the total mass of 100%: 2% methyl methacrylate, 3% n-butyl methacrylate (hard monomer), isooctyl acrylate 15% (soft monomer), ethyl acrylate 15% (soft monomer), acrylic acid 2% (functional monomer), 2-hydroxyethyl acrylate 2% (functional monomer), acrylamide 4% (functional monomer body), toluene 10%, ethyl acetate 45%, AIBN 0.8%, toluene diisocyanate 0.1%, m-xylylenediamine epoxy resin 0.1%, foaming microspheres 1% (initial foaming temperature is 210°C) .

[0068] The preparation method is as follows:

[0069] 1) Mix methyl methacrylate, n-butyl methacrylate, isooctyl acrylate, ethyl acrylate, acrylic acid, 2-hydroxyethyl acrylate, acrylamide, toluene and ethyl acetate at 25°C, Raise the temperature to 75°C within 1h, add AIBN, mix for 2h, raise the temperature to 85°C and react for 1h...

Embodiment 3

[0072] This embodiment provides an adhesive and a preparation method thereof.

[0073] Wherein, the raw materials for the preparation of the adhesive include the following components based on the total mass of 100%: 2% methyl methacrylate, 2% ethyl methacrylate (hard monomer), 30% ethyl acrylate (soft monomer), butyl acrylate 5% (soft monomer), acrylic acid 1% (functional monomer), 2-hydroxyethyl acrylate 2% (functional monomer), acrylamide 2% (functional monomer) , toluene 16%, ethyl acetate 34.5%, dibenzoyl peroxide 0.5%, toluene diisocyanate 1%, hexamethylene diisocyanate 1%, foaming microspheres 3% (initial foaming temperature is 210 ° C ).

[0074] The preparation method is as follows:

[0075] 1) Mix methyl methacrylate, ethyl methacrylate, ethyl acrylate, butyl acrylate, acrylic acid, 2-hydroxyethyl acrylate, acrylamide, toluene and ethyl acetate at 25°C, within 1h Raise the temperature to 75°C, add dibenzoyl peroxide, mix for 2 hours, raise the temperature to 85°C f...

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Abstract

The invention provides an adhesive, a preparation method thereof, an adhesive layer prepared from the adhesive and a heat-reducing adhesive tape. The adhesive is prepared from the following raw materials: a hard monomer, a soft monomer, a functional monomer, a solvent, an initiator, a curing agent and foamed microspheres. According to the adhesive disclosed by the invention, firstly, specific monomers are selected for polymerization, and the high temperature resistance of adhesive layers is effectively improved; secondly, the foaming microspheres are creatively introduced into the preparationraw materials, therefore, after the obtained adhesive layers are compounded with base material layers, heavy release layers and light release layers, the high-temperature-resistant heat-reducing adhesive tape can be obtained, the adhesive layers can be separated from an adhered object through the expansion effect of the microspheres by foaming of the microspheres, and the problem of adhesive residue is fundamentally solved; moreover, at a specific temperature, a stripping process used for debonding the adhesive tape becomes simpler, so that the aims of reducing the processing procedures and improving the production efficiency are fulfilled.

Description

technical field [0001] The invention relates to the technical field of functional adhesive tapes, in particular to an adhesive, a preparation method thereof, an adhesive layer prepared therefrom, and a heat-adhesive adhesive tape. Background technique [0002] In the semiconductor manufacturing process, when cutting and polishing semiconductor wafers, in order to reduce the defect density of silicon thin layers, wafer cutting and adhesion-reducing protective films are often used. In the prior art, a high-temperature-resistant protective film is used as a bearing, and after a specific temperature, the protective film is peeled off. Due to long-term high-temperature conditions, the traditional high-temperature protective film will have the risk of residual glue, and the viscosity will increase after a long time, making it difficult to peel off later. [0003] CN107163869A discloses a heat-adhesive adhesive tape and a preparation method thereof, comprising a release film layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J163/00C09J11/06C08F220/18C08F220/14C08F220/06C08F220/20C08F220/56C08J9/32C09J7/30
CPCC08F220/18C08J9/32C08J2203/22C08J2333/26C09J11/06C09J133/26C09J2433/00C09J7/30C09J2301/30C08L63/00C08K5/29
Inventor 李阜阳韩晓航刘源陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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