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A method for processing through-groove of rigid-flex board

A technology of rigid-flex boards and processing methods, which is applied in the manufacture of multi-layer circuits, etc., can solve the problems of gasket falling off, cumbersome operations of taking and placing gaskets, etc., and achieve the effect of simplifying the production problem and solving the problem of residual glue

Active Publication Date: 2016-08-10
GCI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a through-groove processing method for a rigid-flexible plate, linking the gasket and the edge of the groove through bridge points, and milling off the bridge points at this position by using a gong machine after pressing. Then the gasket will fall off naturally, which solves the problem of residual glue on the edge of the groove and the cumbersome operation of taking and placing the gasket before and after pressing, and meets the needs of the product

Method used

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  • A method for processing through-groove of rigid-flex board
  • A method for processing through-groove of rigid-flex board
  • A method for processing through-groove of rigid-flex board

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Embodiment Construction

[0024] A method for processing a through-groove of a rigid-flexible board, comprising the following steps,

[0025] S1. If Figure 5 , 6 In the process, pass through the groove for No-flow prepreg 20 times, take out the prepreg in the groove after passing through the groove for No-flow prepreg 20 times; Bridge point 60 is set in the area other than the outline line, the bridge point 60 does not open the groove, and the other positions between the sub-core board 10 and the gasket 50 except the bridge point 60 open the groove;

[0026] In this embodiment, the width of the bridge point 60 is 2-10 mm. The width of 2-10mm can not only ensure the link between the gasket 50 and the edge of the groove, but also can easily break the bridge point 60 by the gong machine during the subsequent process of breaking the bridge, and the gasket 50 will fall off naturally, which solves the problem. Solve the problem of adhesive tape residue on the edge of the groove, and simplify the producti...

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Abstract

The present invention relates to the technical field of manufacturing methods of printed boards, and more particularly, to a method for processing through grooves of rigid-flexible boards. A method for processing a through-groove of a rigid-flexible board, which includes the following steps, S1. For the No-flow prepreg through-groove, a bridge point is set on a sub-core board corresponding to a region other than the outline line of the flexible area, and on the sub-core board Between the spacer and the other positions except the bridge point, open the groove; S2. Place the No-flow prepreg and the sub-core board on the mother core board in sequence, and then perform riveting; S3. Place the riveted rigid-flex board Perform hot pressing in the laminator to form a rigid-flex board; S4. After lamination, place the board in the laminating machine, and break the bridge, and leave the other positions untouched. In the present invention, when the sub-core board of the rigid-flexible board passes through the groove, the gasket is connected with the edge of the groove through the form of bridge points, and the bridge at this position is broken by using a drilling machine after lamination, and the gasket naturally falls off. Solve the problem of adhesive tape residue on the edge of the groove, and simplify the production of gaskets at the same time.

Description

technical field [0001] The present invention relates to the technical field of manufacturing methods of printed boards, and more particularly, to a method for processing through grooves of rigid-flexible boards. Background technique [0002] With the development of PCBs in the direction of small size and light weight, rigid boards have begun to transform into rigid-flexible boards. When rigid-flexible boards are pressed together, the rigid layer in the flexible area of ​​the rigid-flexible board needs to be hollowed out. In order to avoid When the rigid-flex board is pressed, the rigid layer near the hollowed out area is deformed, so it is often used to add gaskets in the hollowed out area to eliminate the difference between the rigid-flex board and the ordinary board. Due to the change in size and the gradual expansion of the market, the current processing method of gaskets is difficult to meet the requirements of rigid-flex board manufacturing. [0003] At present, the th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 侯金坤任代学陈翔任安源
Owner GCI SCI & TECH
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