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A process method of asymmetric multi-layer rigid-flex board with air cavity

A technology of rigid-flex board and process method, which is applied in multilayer circuit manufacturing, electrical components, printed circuits, etc. It can solve the problems of scratched appearance of solder pads, difficulty in manual uncovering, and low production efficiency, so as to improve product quality , Solve the difficulty of manual uncovering and ensure the effect of product quality

Active Publication Date: 2021-02-19
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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Problems solved by technology

Moreover, it is easy to cause difficulties in manual uncovering, residual glue in the air cavity, pad scratches, and abnormal appearance. Its production efficiency is low and the yield rate is poor.
At present, there is no proper design scheme and production mode for this type of product in the industry

Method used

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  • A process method of asymmetric multi-layer rigid-flex board with air cavity

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Embodiment Construction

[0026] The process method of the asymmetric multi-layer rigid-flex board with an air cavity of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.

[0027] refer to figure 1 , a non-limiting embodiment of the present invention, a process method of an asymmetric multi-layer rigid-flex board with an air cavity, comprising the following steps,

[0028] S1: For the production of multi-layer flexible boards, a cover film with a size larger than the size of the flexible board area is pasted on both sides of the double-sided copper-clad laminate FCCL, and pure glue with air cavities is stacked on the outer surface of the cover film layer, and finally stack the single-sided copper-clad laminate FCCL on the outer surface of the pure adhesive layer. Covering film, after the above-mentioned layers are stacked, perform the first pressing process to obtain a multi-layer flexible board, in which the middle area...

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Abstract

The invention relates to a process method of an asymmetric multilayer rigid-flex board with an air cavity. The process method first prepares double-sided copper-clad laminates, single-sided copper-clad laminates and pure glue, and then prepares the prepared double-sided copper-clad laminates. The upper and lower sides of the multilayer flexible board are stacked with pure rubber and single-sided copper clad laminates in turn to form a multilayer flexible board; then the prepared PP1 and The first copper foil, and a PI protective film is stacked on the outer surface of the first copper foil in the low-level rigid plate area, and the second pressing is performed; then the prepared PP2 is sequentially stacked on the upper and lower sides of the prepared plate. And the second copper foil, carry out the third pressing, after the pressing, carry out CO2 laser controlled deep opening, and after uncovering and forming, perform OSP surface treatment to obtain the finished board. The process method of the asymmetric multi-layer rigid-flex board with air cavity of the present invention has the advantages of good quality, high efficiency and the like.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a process method of an asymmetric multi-layer rigid-flex board with an air cavity. Background technique [0002] In the process design and production process of the multi-layer rigid-flex board and the air cavity of the multi-layer rigid-flex board, there are rigid board area opening design, pure rubber / PI protective film lamination design, air cavity design, process design, etc. Many questions. Moreover, it is easy to cause difficulties in manual uncovering, residual glue in the air cavity, scratches on the pads, and abnormal appearance. Its production efficiency is low and the yield rate is poor. At present, there is no proper design scheme and production mode for this type of product in the industry. Contents of the invention [0003] The invention provides a process method of an asymmetric multi-layer rigid-flex board with an air cavity, which has good pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4644H05K3/4652H05K3/4691
Inventor 周刚王康兵
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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