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Processing method for slotting process of ridge-flexible combination board

A technology of rigid-flex board and process processing, which is applied in the direction of multi-layer circuit manufacturing, etc. It can solve the problems of residual glue on the groove edge, gasket falling off, cumbersome operation of picking and placing gaskets, etc., so as to simplify the production problem and solve the problem of residual glue Effect

Active Publication Date: 2013-10-16
GCI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a through-groove processing method for rigid-flexible boards, linking the gasket to the edge of the groove in the form of a bridge point, and milling off the bridge point at this position by using a gong machine after lamination , the gasket will fall off naturally, which solves the problem of residual glue on the edge of the groove and the cumbersome operation of taking and placing the gasket before and after pressing, and meets the needs of the product

Method used

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  • Processing method for slotting process of ridge-flexible combination board
  • Processing method for slotting process of ridge-flexible combination board
  • Processing method for slotting process of ridge-flexible combination board

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Embodiment Construction

[0024] A through-groove processing method for a rigid-flex board, comprising the following steps,

[0025] S1. If Figure 5 , 6 In the process, pass through the groove for No-flow prepreg 20 times, take out the prepreg in the groove after passing through the groove for No-flow prepreg 20 times; Bridge point 60 is set in the area other than the outline line, the bridge point 60 does not open the groove, and the other positions between the sub-core board 10 and the gasket 50 except the bridge point 60 open the groove;

[0026] In this embodiment, the width of the bridge point 60 is 2-10 mm. The width of 2-10mm can not only ensure the link between the gasket 50 and the edge of the groove, but also can easily break the bridge point 60 by the gong machine during the subsequent process of breaking the bridge, and the gasket 50 will fall off naturally, which solves the problem. Solve the problem of adhesive tape residue on the edge of the groove, and simplify the production of gas...

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Abstract

The invention relates to the technical field of a manufacturing method of a printed board, particularly to a processing method for a slotting process of a ridge-flexible combination board. The processing method comprises the following steps: S1, carrying out punching slotting processing on a No-flow prepreg, arranging a bridge point at an area correspondingly beyond a flexible region trim line at a sub core plate and carrying out punching slotting on positions, except the bridge point, between the sub core plate and a gasket; S2, successively placing the No-flow prepreg and the sub core plate on a mother core plate and carrying out riveting; S3, placing the riveted ridge-flexible combination board in a laminating machine to carry out hot pressing so as to form a ridge-flexible combination board; and S4, carrying out stitching and then placing the board in a punching machine to punch and break the bridge point with other positions not punched. According to the invention, when punching slotting is carried out at the sub core plate of the ridge-flexible combination board, the gasket and the slot edges are linked and connected by the bridge point; and after the lamination, the punching machine is used to punch and break the bridge point, so that the gasket falls off naturally. Therefore, a problem of adhesive residue of the adhesive tapes at the slot edges can be solved; and a gasket manufacturing process is simplified.

Description

technical field [0001] The present invention relates to the technical field of manufacturing methods of printed boards, and more specifically, to a through-groove processing method for rigid-flex boards. Background technique [0002] With the development of PCBs in the direction of small size and light weight, rigid boards have begun to transform into rigid-flexible boards. When rigid-flexible boards are pressed together, the rigid layer in the flexible area of ​​the rigid-flexible board needs to be hollowed out. In order to avoid When the rigid-flex board is pressed, the rigid layer near the hollowed out area is deformed, so it is often used to add gaskets in the hollowed out area to eliminate the difference between the rigid-flex board and the ordinary board. Due to the change in size and the gradual expansion of the market, the current processing method of gaskets is difficult to meet the requirements of rigid-flex board manufacturing. [0003] At present, the through-gr...

Claims

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Application Information

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IPC IPC(8): H05K3/46
Inventor 侯金坤任代学陈翔任安源
Owner GCI SCI & TECH
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