The invention provides a Josephson junction satisfying a large
wafer size, a preparation method and an application. The Josephson junction is prepared by preparing a Ta (110) film on a substrate, preparing a superconducting circuit structure through photoetching, forming a lower
electrode Ta (110) layer through
mask photoetching, preparing a Ta2O5
oxide layer on the surface of the lower
electrode Ta (110) layer as an intermediate layer, and forming an upper
electrode Ta (110) layer through
mask photoetching. The Ta (110) superconducting thin film is used as the lower electrode and the upper electrode of the Josephson junction, the Ta2O5
oxide layer on the surface of the Ta (110) superconducting thin film has the characteristics of compactness, stability and the like,
passivation and optimization can be performed by adopting a
piranha solution, photoetching residual glue is further removed, the stability of a superconducting circuit structure and the Josephson junction is ensured, the method has the characteristics of simple process steps, stability,
controllability, high integration level and the like, and the method is suitable for large-scale production. Uniform and stable Josephson junctions in a large
wafer size range can be prepared, and the method is suitable for regulation and control of Josephson junctions with different areas.