The invention discloses an electroplated
copper foil
electroplating liquid leveling agent with a
crystal face guiding effect, and the leveling agent is
thiamine, N-ethyl
ethylenediamine,
glycine, N, N-bis (2-ethoxyl)
glycine,
hexamethylphosphoramide,
theophylline, 3-cyanopyridine, 2-hydroxypyridine, beta-methylpyridine, 1-(2-
mercaptobenzothiazole-3-yl)
imidazole, 1, 2-diphenyl-1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol, 1, 3-pentanediol and 1, 3-pentanediol. The catalyst is selected from one or more of 1, 3-bis (1-imidazolyl)
propane, 2-amino-4-methylbenzothiazole and
pyridinium propanesulfonate. The leveling agent disclosed by the invention can homogenize grain size distribution on the surface of the electroplated
copper foil and reduce a
wrinkle phenomenon caused by microstress in a post-treatment process of the
copper foil; meanwhile, the material can be adsorbed on the surface of the
copper foil, copper
ion nucleation overpotential is increased, deposited grains are refined, and the tensile strength of the
copper foil is improved.