Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH)
A production method and technology of multi-layer boards, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of low lamination efficiency, product scrapping, slow efficiency, etc., and achieve the effect of high work efficiency and high work accuracy.
Inactive Publication Date: 2012-06-13
江苏协和电子股份有限公司
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The invention relates to a production method of copper sheet gluing of an outer layer window of a multi-layer board and a selective plated through hole (PTH), which includes the following steps: (1) drilling holes with the same diameter at the same positions of a copper sheet and a bottom layer product and conducting gluing operation in locating mode through a jig cover; (2) conducting secondary drilling after the copper sheet and the bottom layer product are glued and printing a layer of peelable ink through a screen printing method at places needing shielding on the surface of the product; and (3) baking the product to cure the peelable ink and conducting plated through hole (PTH) operation. By means of the production method, operation precision and efficiency are high, and requirements of proficiency of staff are not high under the condition of labor shortage. Floating and falling do not exist when a PTH line works, exposed circuits can be fully covered, and a condition of covering a via hole can not occur.
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