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Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH)

A production method and technology of multi-layer boards, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of low lamination efficiency, product scrapping, slow efficiency, etc., and achieve the effect of high work efficiency and high work accuracy.

Inactive Publication Date: 2012-06-13
江苏协和电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of these two methods are: 1. The requirements for personnel skills are very high. Even if skilled employees are used to operate, there will still be problems of sticking deviation and wrinkles, and the efficiency is slow
2. Due to the need to use sticky tape for bonding, the operation is difficult, and the bonding efficiency is extremely low, and once the via hole is covered by a deviation, the product will be scrapped
Moreover, the tape is easily corroded and floated by the chemical liquid during PTH operation, resulting in exposed copper on the line, causing the product to form a short circuit and be scrapped

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Examples now illustrate the present invention in further detail.

[0013] The invention relates to a production method for laminating and selective PTH of the outer window copper skin of a multilayer board, comprising the following steps:

[0014] 1) Drill holes with the same diameter at the same position of the copper skin and the bottom product, and use the jig cover to position the hole for lamination;

[0015] 2) After the copper skin and the bottom product are bonded, perform a second drill, and print a layer of peelable glue by screen printing on the place where the product surface needs to be covered;

[0016] 3) Baking the product and curing the peelable adhesive, and then proceed to PTH operation.

[0017] After the PTH operation, the peelable glue does not float up, and it covers the exposed lines intact.

[0018] In the step 1), the bottom product is positioned and fixed on the jig through the jig sleeve, and then the copper skin is covered on the bottom pr...

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PUM

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Abstract

The invention relates to a production method of copper sheet gluing of an outer layer window of a multi-layer board and a selective plated through hole (PTH), which includes the following steps: (1) drilling holes with the same diameter at the same positions of a copper sheet and a bottom layer product and conducting gluing operation in locating mode through a jig cover; (2) conducting secondary drilling after the copper sheet and the bottom layer product are glued and printing a layer of peelable ink through a screen printing method at places needing shielding on the surface of the product; and (3) baking the product to cure the peelable ink and conducting plated through hole (PTH) operation. By means of the production method, operation precision and efficiency are high, and requirements of proficiency of staff are not high under the condition of labor shortage. Floating and falling do not exist when a PTH line works, exposed circuits can be fully covered, and a condition of covering a via hole can not occur.

Description

technical field [0001] The invention relates to a production process of a soft board, in particular to a production method for laminating the outer window copper skin of a multilayer board and selective PTH. Background technique [0002] Due to the characteristics of the product, multi-layer board products need to open a window on the outer copper skin to expose the "finger" of the inner layer circuit, and also need to connect the inner layer circuit to the shielding layer of the outer copper skin. This kind of product needs to be laminated on the outer layer with a layer of thinner copper skin that has been opened to make a shielding layer. Because the copper skin is thinner and glued with pure glue, it is very easy to cause lamination wrinkles and sticking when manual lamination. The problem of alignment. At the same time, this kind of product structure requires the operation of plated through holes after the second drilling to make the upper and lower layers of the produ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 张南国
Owner 江苏协和电子股份有限公司
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