Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH)
A production method and technology of multi-layer boards, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of low lamination efficiency, product scrapping, slow efficiency, etc., and achieve the effect of high work efficiency and high work accuracy.
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[0012] Examples now illustrate the present invention in further detail.
[0013] The invention relates to a production method for laminating and selective PTH of the outer window copper skin of a multilayer board, comprising the following steps:
[0014] 1) Drill holes with the same diameter at the same position of the copper skin and the bottom product, and use the jig cover to position the hole for lamination;
[0015] 2) After the copper skin and the bottom product are bonded, perform a second drill, and print a layer of peelable glue by screen printing on the place where the product surface needs to be covered;
[0016] 3) Baking the product and curing the peelable adhesive, and then proceed to PTH operation.
[0017] After the PTH operation, the peelable glue does not float up, and it covers the exposed lines intact.
[0018] In the step 1), the bottom product is positioned and fixed on the jig through the jig sleeve, and then the copper skin is covered on the bottom pr...
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