Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH)

A production method and technology of multi-layer boards, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of low lamination efficiency, product scrapping, slow efficiency, etc., and achieve the effect of high work efficiency and high work accuracy.

Inactive Publication Date: 2012-06-13
江苏协和电子股份有限公司
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AI-Extracted Technical Summary

Problems solved by technology

However, the disadvantages of these two methods are: 1. The requirements for personnel skills are very high. Even if skilled employees are used to operate, there will still be problems of sticking deviation and wrinkles, and the efficiency is slow
2. Due to the need to use sticky tape for bonding, the operation is diffic...
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Abstract

The invention relates to a production method of copper sheet gluing of an outer layer window of a multi-layer board and a selective plated through hole (PTH), which includes the following steps: (1) drilling holes with the same diameter at the same positions of a copper sheet and a bottom layer product and conducting gluing operation in locating mode through a jig cover; (2) conducting secondary drilling after the copper sheet and the bottom layer product are glued and printing a layer of peelable ink through a screen printing method at places needing shielding on the surface of the product; and (3) baking the product to cure the peelable ink and conducting plated through hole (PTH) operation. By means of the production method, operation precision and efficiency are high, and requirements of proficiency of staff are not high under the condition of labor shortage. Floating and falling do not exist when a PTH line works, exposed circuits can be fully covered, and a condition of covering a via hole can not occur.

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Technology Topic

Examples

  • Experimental program(1)

Example Embodiment

[0012] The examples will now illustrate the present invention in further detail.
[0013] A method for producing a multi-layer board outer layer windowed copper skin lamination and selective PTH, comprising the following steps:
[0014] 1) Drill holes with the same diameter at the same position of the copper skin and the underlying product, and use the jig sleeve to locate the position for the fitting operation;
[0015] 2) After the copper skin and the underlying product are laminated, carry out two drills, and print a layer of peelable glue by screen printing in the place where the surface of the product needs to be shielded;
[0016] 3) Bake the product and cure the peelable glue, and then do the PTH operation.
[0017] After the PTH operation, the peelable glue does not float up, and it covers the exposed circuit perfectly.
[0018] In the step 1), the bottom product is first positioned and fixed on the fixture through the fixture cover, and then the copper sheet is covered on the bottom product in the same way, and finally the cover plate is laminated. In this way, multiple products can be stacked at one time. This operation method does not require high proficiency of personnel, and has high fitting precision and high efficiency.
[0019] The peelable adhesive in the step 2) is acid and alkali resistant peelable adhesive. This is for the purpose of covering and protecting the exposed lines. After the PTH operation, peel off the peelable adhesive for subsequent operations. In addition, this operation method has high operation efficiency and high covering accuracy, and does not cover the via hole. Operation efficiency is improved by more than 300%.
[0020] What is described in the above specification are only specific embodiments of the present invention, and various examples do not limit the essence of the present invention. Those of ordinary skill in the art can make modifications to the specific embodiments described above after reading the specification or variations without departing from the spirit and scope of the invention.
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Description & Claims & Application Information

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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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