Production method of copper sheet gluing of outer layer window of multi-layer board and selective plated through hole (PTH)

A production method and technology of multi-layer boards, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of low lamination efficiency, product scrapping, slow efficiency, etc., and achieve the effect of high work efficiency and high work accuracy.

Inactive Publication Date: 2012-06-13
江苏协和电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of these two methods are: 1. The requirements for personnel skills are very high. Even if skilled employees are used to operate, there will still be problems of sticking deviation and wrinkles, and the efficiency is slow
2. Due to the need to use sticky tape for bonding, the operation is diffic

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0012] The examples will now illustrate the present invention in further detail.

[0013] A method for producing a multi-layer board outer layer windowed copper skin lamination and selective PTH, comprising the following steps:

[0014] 1) Drill holes with the same diameter at the same position of the copper skin and the underlying product, and use the jig sleeve to locate the position for the fitting operation;

[0015] 2) After the copper skin and the underlying product are laminated, carry out two drills, and print a layer of peelable glue by screen printing in the place where the surface of the product needs to be shielded;

[0016] 3) Bake the product and cure the peelable glue, and then do the PTH operation.

[0017] After the PTH operation, the peelable glue does not float up, and it covers the exposed circuit perfectly.

[0018] In the step 1), the bottom product is first positioned and fixed on the fixture through the fixture cover, and then the copper sheet is cove...

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PUM

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Abstract

The invention relates to a production method of copper sheet gluing of an outer layer window of a multi-layer board and a selective plated through hole (PTH), which includes the following steps: (1) drilling holes with the same diameter at the same positions of a copper sheet and a bottom layer product and conducting gluing operation in locating mode through a jig cover; (2) conducting secondary drilling after the copper sheet and the bottom layer product are glued and printing a layer of peelable ink through a screen printing method at places needing shielding on the surface of the product; and (3) baking the product to cure the peelable ink and conducting plated through hole (PTH) operation. By means of the production method, operation precision and efficiency are high, and requirements of proficiency of staff are not high under the condition of labor shortage. Floating and falling do not exist when a PTH line works, exposed circuits can be fully covered, and a condition of covering a via hole can not occur.

Description

technical field [0001] The invention relates to a production process of a soft board, in particular to a production method for laminating the outer window copper skin of a multilayer board and selective PTH. Background technique [0002] Due to the characteristics of the product, multi-layer board products need to open a window on the outer copper skin to expose the "finger" of the inner layer circuit, and also need to connect the inner layer circuit to the shielding layer of the outer copper skin. This kind of product needs to be laminated on the outer layer with a layer of thinner copper skin that has been opened to make a shielding layer. Because the copper skin is thinner and glued with pure glue, it is very easy to cause lamination wrinkles and sticking when manual lamination. The problem of alignment. At the same time, this kind of product structure requires the operation of plated through holes after the second drilling to make the upper and lower layers of the produ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 张南国
Owner 江苏协和电子股份有限公司
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