Conveying system for wafer-shaped object

A technology of conveying system and objects, applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems of complex motion precision design, complex movement path of accessing wafers, affecting the speed of accessing wafers, etc., to achieve fast and reliable access, The effect of reducing footprint area and simple motion path

Active Publication Date: 2014-09-10
BEIJING SEVENSTAR ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] This method involves the cooperation of one rotary motion with another compound motion composed of rotary motion and linear motion. The design of motion precision is relatively complicated, which affects the speed of accessing wafers, and the movement path of accessing wafers is complicated.

Method used

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  • Conveying system for wafer-shaped object
  • Conveying system for wafer-shaped object

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Embodiment Construction

[0017] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0018] like Figure 1-2 As shown, the conveying system for wafer-shaped objects according to the present invention includes at least two processing units 1 and manipulators 2. The distance between the manipulators 2 and each processing unit 1 is equal, and is used to transport wafer-shaped objects to be processed placed in the processing unit 1, and the processed wafer-shaped object is taken out. The distance between the center of the access arm of the manipulator 2 and the processing center of each processing unit is equal.

[0019] Preferably, the processing units 1 are arranged in a circular or regular polygonal array.

[0020] Preferably, at least one cassette 3 is ...

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Abstract

The invention discloses a conveying system for a wafer-shaped object, which belongs to the technical field of semiconductor wafer manufacture. The conveying system comprises at least two processing units (1) and mechanical hands (2), wherein, the distances between the mechanical hands (2) and the processing units (1) are equivalent, and the mechanical hands (2) are used for placing the wafer-shaped object to be processed in the processing units (1) and taking out the wafer-shaped object that is processed. The conveying system can store and take out the wafer-shaped object through the self-rotation and the lifting of the two mechanical hands by enabling the distances between the mechanical hands (2) and the processing units (1) to be equivalent, and can adopt a temporary storage platform to transit so as to achieve one wafer transition process or directly convey wafers to processing unit areas with the help of the movement of the mechanical hands on guiding rails after taking wafers from cassette areas by adopting the mechanical hands provided with the guiding rails; the two manners achieve simple motion path and are rapid and reliable to store and take out; and meanwhile, the conveying system can effectively reduce the occupied track area by compared with the same type of equipment.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing, in particular to a conveying system for wafer-shaped objects. Background technique [0002] In the prior art, the processing unit of the device used to transport wafer-shaped objects is usually linearly arranged and symmetrical on both sides, and a fixed manipulator is used to rotate and pick up the wafer (or a manipulator with a guide rail cooperates with the pick-up) and place a temporary storage table. Another linear drive device picks and places wafers between the wafer processing unit and the temporary storage table. [0003] This method involves the cooperation of one rotary motion with another compound motion composed of rotary motion and linear motion. The design of motion precision is relatively complicated, which affects the speed of accessing chips, and the path of accessing wafers is complicated. Contents of the invention [0004] (1) Technical problems to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/90H01L21/677
Inventor 高浩
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD
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