Conveying system for wafer-shaped object

Abstract

The invention discloses a conveying system for a wafer-shaped object, which belongs to the technical field of semiconductor wafer manufacture. The conveying system comprises at least two processing units (1) and mechanical hands (2), wherein, the distances between the mechanical hands (2) and the processing units (1) are equivalent, and the mechanical hands (2) are used for placing the wafer-shaped object to be processed in the processing units (1) and taking out the wafer-shaped object that is processed. The conveying system can store and take out the wafer-shaped object through the self-rotation and the lifting of the two mechanical hands by enabling the distances between the mechanical hands (2) and the processing units (1) to be equivalent, and can adopt a temporary storage platform to transit so as to achieve one wafer transition process or directly convey wafers to processing unit areas with the help of the movement of the mechanical hands on guiding rails after taking wafers from cassette areas by adopting the mechanical hands provided with the guiding rails; the two manners achieve simple motion path and are rapid and reliable to store and take out; and meanwhile, the conveying system can effectively reduce the occupied track area by compared with the same type of equipment.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing, in particular to a conveying system for wafer-shaped objects. Background technique [0002] In the prior art, the processing unit of the device used to transport wafer-shaped objects is usually linearly arranged and symmetrical on both sides, and a fixed manipulator is used to rotate and pick up the wafer (or a manipulator with a guide rail cooperates with the pick-up) and place a temporary storage table. Another linear drive device picks and places wafers between the wafer processing unit and the temporary storage table. [0003] This method involves the cooperation of one rotary motion with another compound motion composed of rotary motion and linear motion. The design of motion precision is relatively complicated, which affects the speed of accessing chips, and the path of accessing wafers is complicated. Contents of the invention [0004] (1) Technical problems to...

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Problems solved by technology

[0003] This method involves the cooperation of one rotary motion with another compound motion composed of rotary motion and linear motion. The design of motion precision is relatively complicated, which affects the speed of accessing wafers, and the movement path of accessing wafers is complicated.

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