Chip bonding apparatus and chip bonding method
A chip bonding and chip technology, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., and can solve problems such as time-consuming and labor-intensive
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[0048] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0049] Please refer to image 3 , with the horizontal direction as the X direction, the vertical direction perpendicular to the horizontal plane as the Z direction, and the plane formed perpendicular to the X and Z directions as the Y direction, an XYZ three-dimensional coordinate system is established. The invention provides a chip bonding device, which includes from top to bottom
[0050] There are several batches of chip transfer parts 203 , substrate carrying parts 202 and bonding force output parts 201 .
[0051] Specifically, several groups of batch chip transfer components 203 are arranged in six groups in this embodiment, forming two columns respectively, as Figure 5 As shown, the first to third batches of chip transmission ...
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