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Method for manufacturing radiofrequency transmission substrates

A technology of radio frequency emission and manufacturing method, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, electrical components, etc., can solve problems such as "burrs", and achieve the effect of ensuring accuracy requirements and clean and smooth lines

Inactive Publication Date: 2012-06-20
江苏协和电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to propose a method for manufacturing a radio frequency transmitting substrate that can ensure product accuracy and completely solve the problem of "burrs" at the edge of the line

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Now, the present invention will be described in further detail in conjunction with preferred embodiments.

[0017] A method for manufacturing a radio frequency emission substrate, comprising the following steps:

[0018] 1) Make copper plate chamfering on the substrate, and degrease and polish the substrate;

[0019] 2) After the above steps are completed, the substrate is micro-etched, and a photosensitive dry film is pasted on the surface of the substrate by wet film bonding;

[0020] 3) Expose the circuit on the photosensitive dry film and develop it;

[0021] 4) Etching the circuit on the substrate, and forming a product after film removal, polishing and surface treatment.

[0022] The radio frequency transmitting substrate of the present invention is a copper plate.

[0023] The process of chamfering the copper plate is: use a file or other tools to process the sharp right angle of the copper plate into a smooth rounded corner to prevent damage to the production...

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Abstract

The invention relates to a method for manufacturing radiofrequency transmission substrates, which includes the following steps of 1) chamfering copper plates for making substrates and removing oil of the substrates and polishing the same; 2) microetching the substrates after the step 1) is completed, laminating dry sensitive films on surfaces of the substrates by means of wet lamination; 3) exposing circuits on the dry sensitive films and developing; and 4) etching the circuits on the substrates, and obtaining finished substrates by film removal, polishing and surface treatment. By the method for manufacturing radiofrequency transmission substrates, precision of the finished substrates can be guaranteed while the problem of 'burrs' at edges of the circuits is solved completely.

Description

technical field [0001] The invention relates to a radio frequency emitting substrate, in particular to a manufacturing method of a radio frequency emitting substrate. Background technique [0002] The material of the radio frequency transmitting substrate is thick pure copper foil. The thickness is as high as 1mm or more. For such a thick copper plate, the traditional circuit production method is steel die stamping. However, the precision of the products produced by this method of stamping and forming cannot be well guaranteed, and the stamping of the mold will inevitably produce "burrs" on the edges of the products, and the "burrs" of the lines will cause "point discharge" during use. Thereby making the use safety performance of the product low. If the line size accuracy and flatness cannot meet the requirements, it will have a great impact on the use of the product. In addition, after the mold has been punched many times, the linear accuracy and flatness of the product...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/00
Inventor 张南国
Owner 江苏协和电子股份有限公司