Method for manufacturing PCB (Printed Circuit Board) with stepped grooves

A technology of PCB board and production method, which is applied in printed circuit manufacturing, electrical components, printed circuits and other directions, can solve the problems of high cost and high requirements for operating skills of silicone sheets, and achieve the effects of low cost, simple operation and high operation efficiency.

Active Publication Date: 2012-06-27
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the rubber sheet is relatively soft. In order to control the flow of glue, it is necessary to use a non-flowing or low-fluidity prepreg, resulting in higher costs. At the same t

Method used

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  • Method for manufacturing PCB (Printed Circuit Board) with stepped grooves
  • Method for manufacturing PCB (Printed Circuit Board) with stepped grooves
  • Method for manufacturing PCB (Printed Circuit Board) with stepped grooves

Examples

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Example Embodiment

[0021] Such as figure 1 versus figure 2 As shown, the manufacturing method of the PCB board with stepped grooves of the present invention includes the following steps;

[0022] Step 1: Provide the prepreg 11, the outer core board 12 and the inner core board 13 with the inner pattern already made, and the outer core board 12, the prepreg 11 and the inner core board 13 are at the corresponding positions of the step groove 16 to be formed Open slots 111, 121, 131 respectively;

[0023] Step 2: Lay the outer core board 12, the prepreg 11 and the inner core board 13 together in a predetermined stacking order;

[0024] Step 3: Fill the through grooves 111, 121, 131 of the outer core board 12, the prepreg 11, and the inner core board 13 with polytetrafluoroethylene (PTFE) gaskets 14, which can be processed by a milling machine to make;

[0025] Step 4: Place PTFE buffer plates 15 on the outer sides of the outer core plates 12 on both sides of the laminate, and perform melt lamination unde...

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Abstract

The invention relates to a method for manufacturing a PCB (Printed Circuit Board) with stepped grooves. The method comprises the following steps of: 1, providing a prepreg and an outer-layer core plate and an inner-layer core plate, on which inner-layer patterns are manufactured, and respectively forming trough grooves at corresponding positions on which the stepped grooves are to be formed; 2, superposing the outer-layer core plate, the prepreg and the inner-layer core plate together according to a preset lamination sequence; 3, filling PTFE (Polytetrafluoroethylene) gaskets in the through grooves of the outer-layer core plate, the prepreg and the inner-layer core plate; 4, placing a PTFE buffer board on the outer side of the outer-layer core plate, and carrying out fusion lamination under a high-temperature and high-pressure condition; and 5, removing the PTFE buffer board after lamination and taking out the filled PTFE gaskets, thereby forming the stepped grooves. According to the method disclosed by the invention, the PTFE gaskets are filled to play roles in buffering and glue blocking, the PTFE buffer board is used for buffering, the filling and placing operation is simple, the operation efficiency is high, and the glue flowing on the edges of the stepped grooves can be stably controlled.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, in particular to a method for manufacturing a PCB board with stepped grooves. Background technique [0002] Circuit board assembly and assembly often need to make stepped grooves locally on the PCB board to meet the reduction of modular assembly volume and increase of wiring density, as well as the realization of special functions. [0003] When making a larger-sized stepped groove, the core board and prepreg can be grooved first, and then filled with silicone sheets for pressing. However, the rubber sheet is relatively soft. In order to control the flow of glue, it is necessary to use a non-flowing or low-fluidity prepreg, resulting in higher costs. At the same time, there is a risk of sliding and squeezing into the stepped groove when the silicone sheet is too thin. Therefore, the operation of placing the silicone sheet Skill requirements are high. Contents of the inventio...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 焦其正唐海波辜义成曾志军
Owner DONGGUAN SHENGYI ELECTRONICS
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