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Method for welding circuit lead of array element of ultrasonic array ultrasound probe

An ultrasonic array and wire bonding technology, applied in the field of medical devices, can solve the problems of large error, depolarization of piezoelectric ceramics, and limited application range of hot presses, and achieve the effects of good consistency, protection performance and high efficiency

Active Publication Date: 2014-03-05
GREEN VALLEY BRAINTECH SHENZHEN MEDICAL TECH CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

The application range of the hot press is limited. It is only suitable for welding array elements on straight planes such as linear arrays or phased arrays. Manual welding is required for convex arrays or concave arrays. However, manual welding is not efficient and has large errors.
In addition, the temperature of the soldering iron or hot press used for welding is as high as 400°C, and the ultrasonic array sound head generally uses piezoelectric ceramics as raw materials. If the welding temperature is too high, the piezoelectric ceramics will be partially depolarized and affect the consistency of the finished sound head. Etc performance

Method used

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  • Method for welding circuit lead of array element of ultrasonic array ultrasound probe
  • Method for welding circuit lead of array element of ultrasonic array ultrasound probe

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Embodiment Construction

[0019] The method for welding the circuit wires of the ultrasonic array sound head elements will be further described in detail below mainly in conjunction with the accompanying drawings and specific embodiments.

[0020] Such as figure 1 As shown, the circuit wire welding method of an ultrasonic array sound head array element in an embodiment includes the following steps:

[0021] Step S1: Prepare or provide ultrasonic array sound heads divided by array element widths and circuit boards adapted to the ultrasonic array sound heads.

[0022] Ultrasonic array sound head can be ultrasonic convex array, concave array, linear array and phased array sound head, etc. There are multiple equal-width array elements on the ultrasonic array sound head. Wherein, the array element includes a main array element and a sub-array element, and a plurality of sub-array elements constitute a main array element.

[0023] Preferably, the ultrasonic array sound head can be a piezoelectric ceramic ...

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Abstract

The invention relates to a method for welding a circuit lead of an array element of an ultrasound array ultrasound probe, which comprises the following steps: preparing or providing an ultrasound array ultrasound probe cut by the width of the array element and a circuit board matched with the ultrasound array ultrasound probe; fixing the circuit board on the ultrasound array ultrasound probe and electrically connecting the array element and a solder pad by ultrasound bonding; and arranging an external circuit lead on the solder pad. The method for welding the circuit lead of the array element of the ultrasound array ultrasound probe is based on an ultrasonic friction principle, does not need heating and scaling powder and avoids umpolarization of the ultrasound array ultrasound probe, so the performance of the ultrasound array ultrasound probe can be protected and the product is consistent; meanwhile, the ultrasound bonding welding method is particularly suitable for welding high-density and high-frequency array circuit lead of the ultrasound array probe, is efficient, may be used for large-batch mass production, and can eliminate operation error caused by human beings and the like.

Description

【Technical field】 [0001] The invention relates to the field of medical equipment, in particular to a method for welding circuit leads of an ultrasonic array sound head element. 【Background technique】 [0002] The traditional welding of the circuit leads of the ultrasonic array sound head element generally adopts hot press welding or manual welding. The application range of the hot press is limited, and it is only suitable for the welding of straight planes such as linear arrays or phased arrays. For convex arrays or concave arrays, manual welding is required, but manual welding is not efficient and has large errors. In addition, the temperature of the soldering iron or hot press used for welding is as high as 400°C, and the ultrasonic array sound head generally uses piezoelectric ceramics as raw materials. If the welding temperature is too high, the piezoelectric ceramics will be partially depolarized and affect the consistency of the finished sound head. and other performa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K20/10
Inventor 李永川李朝辉
Owner GREEN VALLEY BRAINTECH SHENZHEN MEDICAL TECH CO LTD
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