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Alignment signal processing system and alignment signal processing method for lithography equipment

A technology of signal processing and lithography equipment, which is applied in the field of integrated circuit manufacturing equipment, can solve problems affecting the fitting results, etc., and achieve the effect of improving the accuracy of data fitting and the accuracy of collected data

Active Publication Date: 2015-09-30
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
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  • Claims
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AI Technical Summary

Problems solved by technology

Since the raster scanning process will also change the input light intensity, it is difficult to judge the cause of the fluctuation of the sampling data only from the sampling data, but this fluctuation affects the fitting result

Method used

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  • Alignment signal processing system and alignment signal processing method for lithography equipment
  • Alignment signal processing system and alignment signal processing method for lithography equipment
  • Alignment signal processing system and alignment signal processing method for lithography equipment

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Embodiment Construction

[0027] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] In order to achieve higher data fitting accuracy, the present invention provides a signal acquisition and processing system for alignment, including: an optical signal demodulator, used to convert the modulated light intensity signal into a voltage signal, and output SS The signal represents the conversion relationship between the voltage and the light intensity; the analog-to-digital converter is used to convert the analog voltage signal into a digital signal; the timing controller is used to provide the synchronous trigger signal of the voltage signal sampling and the SS signal sampling of the light intensity; A data processor collects the voltage signal and the SS signal, and calibrates the voltage signal according to the SS signal.

[0029] figure 2 A schematic diagram of the silicon wafer alignment signal generation process is sh...

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Abstract

The invention provides an alignment signal processing system for photoetching equipment, which comprises an optical signal demodulator. The optical signal demodulator is used for converting a modulation optical intensity signal into a voltage signal and outputting a spread spectrum (SS) signal; the voltage signal enters a data processing unit after passing through a first analog to digital converter; the SS signal enters the data processing unit after passing through a second analog to digital converter; and the voltage signal is calibrated by the data processing unit according to the SS signal. The alignment signal processing system for the photoetching equipment also comprises a time schedule controller used for controlling the first analog to digital converter and the second analog to digital converter, so that the voltage signal and the SS signal are synchronously sampled. Simultaneously, the invention provides an alignment signal processing method for the photoetching equipment.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing equipment, in particular to an alignment signal processing system and an alignment signal processing method for photolithography equipment. Background technique [0002] Lithography equipment is a kind of equipment used in the manufacture of integrated circuits. The use of this equipment includes but is not limited to: integrated circuit manufacturing lithography equipment, liquid crystal panel lithography equipment, photomask marking equipment, MEMS (micro-electromechanical systems) / MOMS (micro-optical machine system) lithography equipment, advanced packaging lithography equipment, printed circuit board lithography equipment and printed circuit board processing equipment, etc. [0003] In the manufacturing process of integrated circuits IC or other micro-devices, multi-layer masks with different mask patterns are sequentially imaged on silicon wafers coated with photoresist, such...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00G03F7/20
Inventor 程鹏韦学志王海江唐文力陈振飞
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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