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Redundant metal filling method and system utilizing same

A filling method and redundant metal technology, applied in the direction of instruments, computing, electrical digital data processing, etc., can solve the problem of not being able to take into account the calculation accuracy of redundant metal filling, and not being able to well reduce the difference in density of different pane regions, etc. question

Active Publication Date: 2012-07-04
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Claims
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AI Technical Summary

Problems solved by technology

The existing redundant metal filling method cannot take into account the calculation amount and filling accuracy of redundant metal filling, and cannot well reduce the density difference between different pane regions, so it is necessary to improve the existing technology

Method used

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  • Redundant metal filling method and system utilizing same
  • Redundant metal filling method and system utilizing same
  • Redundant metal filling method and system utilizing same

Examples

Experimental program
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Embodiment Construction

[0016] see figure 1 , a redundant metal filling method provided by an embodiment of the present invention includes the following steps:

[0017] Step 00, making a template library containing filling templates of different densities and shapes and sizes and a graphic library including filling blocks of different densities and shapes and sizes.

[0018] Step 10. Set the target metal density D of the pane 1 , The allowable fluctuating range ΔD of the pane density.

[0019] Step 20. Divide the layout into several non-overlapping panes, mark them, and equally divide them into m×n small blocks with side length a.

[0020] Step 30, roughly adjust the metal density in the pane according to the rule-based filling method. Among them, the rule-based filling method is to obtain better density uniformity, thereby reducing the surface thickness variation after CMP. This method is filled according to the design rules proposed by the craft factory, etc., such as layout density must be abo...

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Abstract

The invention provides a redundant metal filling method, which includes: dividing a layout into a plurality of panes which are not overlapped, roughly regulating metal density in the panes according to the regular filling method, and finely regulating and correcting metal density in the panes according to the filling method based on a model. The invention further provides a redundant metal filling system, which comprises a pane dividing module, a first filling module and a second filling module. By the redundant metal filling method and the system utilizing the same, metal is filled according to density classification, the range of the metal density is classified, filling templates are filled by metal of different density in different classification, accuracy of redundant filling can be guaranteed, and computing quantity of data is small.

Description

technical field [0001] The invention relates to the technical field of integrated circuit automation, in particular to a redundant metal filling method and system thereof. Background technique [0002] As the size of transistors enters the nanometer scale, the complexity of circuits becomes higher and larger, and the manufacturability design of chips before production becomes more and more important. Throughout the chip manufacturing process, the quality of the product is controlled by a large number of process parameters, such as: dopant concentration, channel length, parasitic effects, and the thickness of the insulating layer between layers. Process parameters are considered in the design process, and the stability of these process parameters must be controlled to be consistent with the design process in the manufacturing process. Design for Manufacturability (DFM, Design for Manufacturability) technology emerges at the historic moment, and DFM is the process deviation p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 方晶晶陈岚叶甜春
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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