Heat radiator and electrode integrated heat radiating device and manufacturing method thereof

A technology for heat dissipation devices and radiators, applied in the direction of electric solid state devices, semiconductor devices, electrical components, etc., can solve the problems of high cost of LED lamps, achieve the effects of improving heat dissipation efficiency, simplifying production steps, and reducing production costs

Inactive Publication Date: 2014-07-02
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, compared with the lamps used in traditional lighting, the cost of making LED lamps is relatively high, which brings more restrictions to LED lamps.

Method used

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  • Heat radiator and electrode integrated heat radiating device and manufacturing method thereof
  • Heat radiator and electrode integrated heat radiating device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0035] The preparation method of the heat dissipation device of the present invention comprises the following steps:

[0036] 1. The aluminum heat sink is cut and cleaned to obtain the heat dissipation substrate;

[0037] 2. Carry out hard anodic oxidation of aluminum on the heat dissipation substrate, and form an oxide layer on the heat dissipation substrate through oxidation, and the oxide layer achieves the purpose of insulating the heat dissipation substrate;

[0038] 3. Apply epoxy resin or epoxy glass cloth bonding sheet on the oxide layer, then attach copper foil, and heat-press the copper foil and the heat dissipation substrate as one, so that a layer of copper conductive layer is bonded to the oxide layer, or through Plating a layer of copper conductive layer on the oxide layer by evaporation or electroplating, and then etching away the parts that do not need circuit connection on the copper conductive layer according to the series or parallel connection required by t...

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PUM

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Abstract

The invention provides a heat radiator and electrode integrated heat radiating device and a manufacturing method thereof. The heat radiating device comprises a heat radiating substrate, an oxide layer, a copper conducting layer, an LED chip, a fluorescent powder layer, a silver electrode, a rubber frame, a silica gel layer, a protective paint and a heat radiating material, wherein the oxide layer is arranged on the heat radiating substrate; the copper conducting layer is arranged on the oxide layer; the LED chip is arranged in the die bond hole; the fluorescent powder layer is coated on the chip in the die bond hole; the silver electrode is electroplated or evaporated on the copper electrode on both sides of the plated die bond hole; the rubber frame is arranged on the periphery of the silver electrode; the silicon gel layer is coated inside the rubber frame; the protective paint is coated to the outer side of the rubber frame; and the heat radiating material is coated to the back face of the heat radiating substrate. The chip is directly die-bonded on the heat radiating substrate, the situation of too short device service life caused by poor heat radiation all the time is improved, the heat radiating efficiency is well increased, the production steps are simplified, and the production cost is reduced.

Description

technical field [0001] The invention relates to an LED heat dissipation device, in particular to a heat dissipation device integrating a heat sink and an electrode and a preparation method thereof. Background technique [0002] Since Edison invented the light bulb, mankind has entered a new era of using electricity for lighting. Nearly 100 years after the invention of the incandescent lamp, mankind ushered in another revolution in the history of lighting, and it was the invention of LED that led this revolution. LED has the advantages of high efficiency and low consumption, green environmental protection, fast response, and long life. Its impact on the lighting industry is better than the invention of incandescent lamps. With the increasing application range of LEDs, especially the advent of high-power ultra-high brightness LEDs in recent years has greatly expanded the application field of LEDs, the high-efficiency LED market is expanding from the display field to the light...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/62H01L33/00
CPCH01L2224/45144H01L2224/48091H01L2224/49175
Inventor 张方辉张静
Owner SHAANXI UNIV OF SCI & TECH
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