Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate

Abstract

A stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate. The chemical mechanical polishing composition, comprising, as initial components: water; an abrasive; a diquaternary substance according to formula (I); a derivative of guanidine according to formula (II); and, optionally, a quaternary ammonium salt. Also, provided is a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate comprises silicon dioxide; providing the chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate; and dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition has a pH of 2 to 6.

Description

technical field [0001] The present invention generally relates to the field of chemical mechanical polishing. In particular, the present invention relates to a stable, concentratable chemical mechanical polishing composition and a method of chemical mechanical polishing of semiconductor materials and, more particularly, to a , ILD) and shallow trench isolation (shallow trench isolation, STI) method of chemical mechanical polishing of the dielectric layer of the semiconductor structure. Background technique [0002] Modern integrated circuits are fabricated through complex processes in which electronic circuits consisting of semiconductor devices are integrated on small semiconductor structures. Conventional semiconductor devices formed on semiconductor structures include capacitors, resistors, transistors, conductors, diodes, and the like. In the manufacture of advanced integrated circuits, a large number of such semiconductor devices are formed on a single semiconductor s...

AI Technical Summary

Problems solved by technology

Unfortunately, abrasives are expensive and increasing the amount of abrasive can lead to prohibitive costs

At the same time, high concentrations of abrasi

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