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Method for temperature stress limit evaluation of electronic component

A technology of electronic components and temperature stress, applied in instruments, measuring electricity, measuring electrical variables, etc., can solve problems such as lack of development, and achieve the effect of improving device design

Inactive Publication Date: 2014-08-06
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some foreign advanced electronic component reliability assurance laboratories have already carried out research work in this area in the early 1990s, but there was no relatively complete research in this area in China at that time.

Method used

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  • Method for temperature stress limit evaluation of electronic component
  • Method for temperature stress limit evaluation of electronic component
  • Method for temperature stress limit evaluation of electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] Embodiment 1: GaAs microwave monolithic integrated power amplifier circuit chip.

Embodiment 2

[0083] Embodiment 2: Microwave solid-state power tube.

Embodiment 3

[0084] Embodiment 3: digital communication chip FPGA.

[0085] The three embodiments respectively apply three kinds of experimental objects, each of which is representative, and can conduct research and verification on the experimental method for exploring the high temperature limit of components.

[0086] The high temperature step stress test should start from the ambient temperature (generally 20 to 30 degrees Celsius, it can also be the initial temperature selected according to the characteristics of the components or the temperature close to the specification limit under the premise that the reliability of the test sample is fully guaranteed) Start; on the premise of no special requirements, the maximum step increment is 10 degrees Celsius. For temperature-sensitive equipment or components, a smaller step increment should be selected according to the specific conditions of the specimen; the minimum holding time is 10 minutes to reach the temperature of the sample. Set temp...

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Abstract

A temperature stress limit evaluation method for electronic components, including the following steps: screening samples; conducting initial electrical tests on samples, and each index parameter should meet detailed specifications; dividing samples into two groups: control group and test group; the control group is used for comparison with the test group. When the electrical test is performed on the samples of the test group, the samples of the control group are also required to be electrically tested. Step-by-step temperature stress is applied to the test group samples, and the temperature stress limit evaluation test is carried out; data analysis and conclusions are drawn. The beneficial effects of the invention are: the limit evaluation test is carried out in a temperature step manner, and the obtained limit capability of the device is closer to the real value. Effective failure modes of components can be exposed to improve device design. A method is given to detect the stress limit and range of components to meet the higher reliability requirements of aerospace components. Mastering the margin between the actual capability of the components and the specification description ensures the high reliability of the selected components.

Description

technical field [0001] The invention relates to a method for evaluating the application limit of electronic components, in particular to a method for evaluating the limit of temperature stress of electronic components. Background technique [0002] With the rapid development of my country's aerospace technology industry and the implementation of a series of major national projects, there are higher requirements for the performance, function and reliability of supporting components. At the same time, the design thinking of component manufacturers is also changing, from "simply meeting the contract requirements" to "enlarging the product's stress resistance margin as much as possible to ensure that there are no failures during use". Therefore, in order to achieve higher reliability requirements for aerospace components, it is necessary to understand the range or limit of the components to withstand stress, etc., and to grasp the margin between the actual capabilities of the se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00
Inventor 董宇亮毋俊玱张洪伟徐军姜宝钧张小川付琬月
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA