Method for temperature stress limit evaluation of electronic component
A technology of electronic components and temperature stress, applied in the direction of instruments, measuring electricity, measuring electrical variables, etc., can solve problems such as lack of development
Inactive Publication Date: 2012-07-11
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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Problems solved by technology
Some foreign advanced electronic component reliability assurance laboratories have already carried out research work in this area in the early 1990s, but there was no relatively complete research in this area in China at that time.
Method used
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Embodiment 1
[0083] Embodiment 1: GaAs microwave monolithic integrated power amplifier circuit chip.
Embodiment 3
[0085] Embodiment 3: digital communication chip FPGA.
[0086] The three embodiments respectively apply three kinds of experimental objects, each of which is representative, and can conduct research and verification on the experimental method for exploring the high temperature limit of components.
[0087]The high temperature step stress test should start from the ambient temperature (generally 20 to 30 degrees Celsius, it can also be the initial temperature selected according to the characteristics of the components or the temperature close to the specification limit under the premise that the reliability of the test sample is fully guaranteed) Start; on the premise of no special requirements, the maximum step increment is 10 degrees Celsius. For temperature-sensitive equipment or components, a smaller step increment should be selected according to the specific conditions of the specimen; the minimum holding time is 10 minutes to reach the temperature of the sample. Set tempe...
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The invention relates to a method for temperature stress limit evaluation of an electronic component. The method comprises the following steps that: screening is carried out on samples; an initial electric test is carried out on the samples and all index parameters should meet detailed standards; the samples are divided into two groups: a control group and a test group, wherein the control group is used to be compared with the test group; and when an electric test is carried out on the samples of the test group, the samples of the control group should also be processed by the electric test; a stepping temperature stress is applied on the samples of the test group to carry out a temperature stress limit evaluation test; and data analyzing is carried out and a conclusion is obtained. According to the invention, beneficial effects of the provided methods as follows: a temperature stepping mode is employed to carry out a limit evaluation test, so that the obtained electronic component limit capability approaches a true value; a component effective failure mode can be exposed, so that it is convenient to improve the electronic component design; the method is provided to detect the limit and the range of the component bearing stress, so that a high reliability requirement of an aerospace component can be met; and a margin between actual capability and standard description of the component can be mastered, so that high reliability of the selected component can be ensured.
Description
technical field [0001] The invention relates to a method for evaluating the application limit of electronic components, in particular to a method for evaluating the limit of temperature stress of electronic components. Background technique [0002] With the rapid development of my country's aerospace technology industry and the implementation of a series of major national projects, there are higher requirements for the performance, function and reliability of supporting components. At the same time, the design thinking of component manufacturers is also changing, from "simply meeting the contract requirements" to "enlarging the product's stress resistance margin as much as possible to ensure that there are no failures during use". Therefore, in order to achieve higher reliability requirements for aerospace components, it is necessary to understand the range or limit of the components to withstand stress, etc., and to grasp the margin between the actual capabilities of the se...
Claims
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IPC IPC(8): G01R31/00
Inventor 董宇亮毋俊玱张洪伟徐军姜宝钧张小川付琬月
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA