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Low current fuse

A technology for fuses and electrodes used in the manufacture of these fuses, land grid arrays and surface mount microcurrent fuses

Inactive Publication Date: 2012-07-11
AVX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It should be noted that none of the prior art publications address the need to provide surface mountable fuses for millicurrent levels of about 50 mA

Method used

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  • Low current fuse
  • Low current fuse
  • Low current fuse

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[0078] refer to figure 1 , the following preferred embodiments are intended to provide a low current fuse 100 rated to blow if exposed to a maximum current in excess of between 0.1 and 0.5 amps.

[0079] The required dimensions are precisely reproducible and the fuse needs to have a high electromigration resistance. Such precise low-current fuses can be obtained by depositing fuse element 104 comprising nickel or copper traces 3 to 20 μm (micrometers) wide, with a predetermined thickness in the range of 0.2 to 2 microns, and preferably There is an integral pad 106 .

[0080] A thin layer of tantalum 103 is preferably deposited first to obtain good adhesion and prevent interaction between the substrate 102 and the nickel fuse element 104 .

[0081] Glass is selected as the substrate 102 . It should be noted that various glasses, ceramics or glass-ceramics may be used.

[0082] The thin layer 103 of tantalum, which is typically several hundred Angstroms thick, can be deposit...

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Abstract

A multi layer fuse device includes a substrate and an elongated fuse element having a pair of contact pads formed therewith at opposed longitudinal ends thereof formed on one surface of the substrate. In some of embodiments, a pair of passivation layers are provided covering the fuse and contact pads. Windows may be opened through both passivation layers above both of the contact pads, and conductive electrode material is electroplated through the windows to contact the contact pads and to extend partially above a top surface of the passivation layers. Exposed electroplated material may be coated with solderable conductive material or a surface mount termination may be provided. In some of other embodiments, electroplated material may cover a portion of the fuse surface prior to application of the passivation layers and extend to an end of the substrate so that windows are not required. In these embodiments, the electroplated material provides a conductive path of the surface mount termination of a completed device.

Description

technical field [0001] This subject matter relates generally to electrical fuses, and more specifically to land grid array (LGA) and surface mount (SMD) microcurrent fuses using thin film technology. The technology also relates to methods of making these fuses. Background technique [0002] Surface mount has become the preferred technology for circuit board assembly. Consequently, virtually all types of electrical components have been or are being redesigned for surface mount (ie leadless) implementations or applications. The rapid incorporation of surface mount devices (SMDs) into all types of electrical circuits has created a corresponding demand for SMD fuses. [0003] Fuses play an important role on many circuit boards. By fusing circuits, selected sub-circuits, and / or even some individual components, the entire system is prevented from being damaged, which might otherwise be damaged by the failure of a single, localized component. [0004] Many different performance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H85/041H01H85/048
CPCH01H85/0411H01H2085/0414H01H85/06H01H85/48
Inventor A·戈尔斯坦I·戴诺夫H·奥瓦迪亚E·奥尼尔M·达克西亚
Owner AVX CORP
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