Unlock instant, AI-driven research and patent intelligence for your innovation.

LED packaging and dispensing manufacture procedure

An encapsulation and dispensing technology, which is applied to devices, electrical components, circuits, etc. that apply liquid to the surface. and other problems to achieve the effect of improving yield

Inactive Publication Date: 2014-05-07
ZHANJING TECH SHENZHEN +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the type and characteristics of the glue used for packaging are different, and only increasing the pressure or time of glue ejection from the glue needle cannot really effectively solve the problem of dispensing yield.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED packaging and dispensing manufacture procedure
  • LED packaging and dispensing manufacture procedure
  • LED packaging and dispensing manufacture procedure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] see figure 1 , is a cross-sectional view of the LED product structure, the LED product structure 10 includes a base 12 , an LED chip 14 and an encapsulation layer 16 . The base 12 (or carrier) includes a top surface 122 and a bottom surface 124 . An accommodating space 126 is formed on the top surface 122 , and the accommodating space 126 is formed downwardly from the top surface 122 . The accommodating space 126 is used for arranging the LED chip 14 and making electrical connection between the LED chip 14 and the base 12 through the conductive support 18 . After the accommodating space 126 is provided with the LED chip 14 , transparent colloid is injected into the accommodating space 126 to form the encapsulation layer 16 . The encapsulation layer 16 is used to protect the LED product structure 10 and maintain the electrical connection of the LED chip 14 ....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LED packaging and dispensing manufacture procedure. The LED packaging and dispensing manufacture procedure includes steps of providing packaging adhesive; determining characteristic parameters of adhesive materials for preparing the packaging adhesive according to a relation function between viscosity realized by the aid of characteristics of the packaging adhesive and time; determining dispersing flow and parameters according to a relation function among adhesive outlet pressure of a dispensing adhesive needle, time and dispensing frequency; and implementing dispensing according to the dispensing flow and the parameters. The adhesive outlet pressure of the adhesive needle is determined according to the characteristic parameters of the adhesive materials. The dispensing manufacture procedure is determined according to the characteristics of the adhesive materials, and yield of packaging can be increased.

Description

technical field [0001] The invention relates to a glue dispensing process for LED packaging, in particular to a glue dispensing process for LED packaging with characteristics of the glue used for packaging. Background technique [0002] The LED industry is one of the industries that has attracted the most attention in recent years. Up to now, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, in the LED packaging process, a transparent packaging layer is used to cover the LED chip. The transparent encapsulation layer is formed by injecting transparent colloid into the encapsulation structure of the LED through a glue needle. However, there are many types of transparent encapsulation adhesives, which have different characteristics due to differences in hardness, transparency, viscosity, or reliability among materials. Factors such as long time wi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05D1/26H01L33/00H01L33/48
Inventor 孔维江
Owner ZHANJING TECH SHENZHEN