Modified structure of polishing epoxy plate
An epoxy board and polishing machine technology, which is applied to surface polishing machine tools, grinding/polishing equipment, metal processing equipment, etc., can solve problems such as uneven product positions, bruises, and inconvenient picking and placing, and achieve Effects of reduction of defects, prevention of picking and placing products, and simple structure
Active Publication Date: 2015-03-18
赫得纳米科技(昆山)有限公司
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Problems solved by technology
Since the shape of the product is almost the same as the shape of the cavity dug on the epoxy board, it will be inconvenient to pick and place during production, and the straight body of the product will collide with the cavity of the epoxy board during polishing. Cause defects such as unevenness and bruises in the straight body of the product
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[0014] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0015] see figure 1 and figure 2 , the modified epoxy plate structure for polishing of the present invention includes an epoxy plate body 3, which is installed between the upper plate 1 and the lower plate 2 on the polishing equipment. The polishing equipment of this embodiment adopts It is a polishing machine, and a plurality of epoxy board bodies 3 are installed on the upper plate 1 and the lower plate 2 of the polishing machine, which is convenient for fixing the products to be polished.
[0016] In this embodiment, three cavities 31 for fixing the product to be polished are processed on the epoxy board body 3. The cavities 31 are exactly the same in shape as the product to be polished, and the size of the cavities is equal to the size of the...
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The invention discloses a modified structure of a polishing epoxy plate, which comprises an epoxy plate body. The epoxy plate body is arranged between an upper disc and a lower disc on polishing equipment, a plurality of cavities used for fixing products to be polished are arranged on the epoxy plate body, and at least one outwards extending cavity groove which expands outwards is arranged on the wall of each cavity. The cavities on the epoxy plate are improved, namely the outwards extending cavity grooves are arranged on the cavities of the epoxy plate, accordingly, workers take and place the products during operation conveniently, the cavities of the epoxy plate can be more effectively prevented from being collided with cavities of the products during polishing, rejected products are reduced, and yield of the products is increased. In addition, when products such as glass and the like are polished, effects that the products can be taken and placed conveniently, straight bodies of the products cannot become uneven due to the fact that the products are collided with the cavities of the epoxy plate during polishing by the aid of the modified structure. Besides, the modified structure is simple and reasonable in structure and is worthy of popularization and use.
Description
technical field [0001] The invention relates to an epoxy board structure used for polishing glass and other products, and in particular to a modified epoxy board structure for polishing. Background technique [0002] At present, when the polishing machine is polishing the surface of products such as glass, in order to better fix the product, it will dig out a cavity with the size of the product with an epoxy board. Then put the product into the cavity for fixing, so as to carry out surface treatment; while the cavity dug on the surface of the epoxy board is exactly the same as the shape of the product, which is mainly used to fix the product when polishing the surface of the product. Since the shape of the product is almost the same as the shape of the cavity dug on the epoxy board, it will be inconvenient to pick and place during production, and the straight body of the product will collide with the cavity of the epoxy board during polishing. Cause unevenness and bruises a...
Claims
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IPC IPC(8): B24B29/02
Inventor 张全文
Owner 赫得纳米科技(昆山)有限公司