Circuit board die set and manufacturing method therefor
A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems affecting the assembly efficiency of electronic equipment, and achieve the effects of facilitating assembly, improving quality, and improving efficiency
Active Publication Date: 2014-12-10
AVARY HLDG (SHENZHEN) CO LTD +1
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- Description
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Problems solved by technology
However, the bent circuit board itself cannot maintain its bent angle very well, and it needs to be bent again when it is installed in electronic equipment
Method used
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[0029] The circuit board module provided by the technical solution and its manufacturing method will be further described below in conjunction with the accompanying drawings and embodiments.
[0030] see Figure 1 to Figure 3 , The circuit board module 100 provided by the embodiment of the technical solution includes a fixing frame 110 , a plurality of flexible circuit boards and a connector 130 .
[0031] The fixing frame 110 is used for carrying and fixing a plurality of flexible circuit boards. In this embodiment, the fixing frame 110 includes a first fixing plate 111 , a second fixing plate 112 , a third fixing plate 113 , a first fixing member 114 and a second fixing member 115 .
[0032] The first fixing plate 111 , the second fixing plate 112 and the third fixing plate 113 are sequentially connected. In this embodiment, the first fixed plate 111, the second fixed plate 112 and the third fixed plate 113 are all rectangular plates, in order to make the first fixed plate...
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A circuit board die set comprises a plurality of flexible circuit boards, a plurality of fixing plates, a plurality of fixing pieces and connectors, wherein, the fixing plates are mutually connected in sequence. At least part of the flexible circuit boards needs to be bent to form a predetermined angle. Each fixing piece comprises two fixing sheets and a connecting sheet, wherein, the two fixing sheets are parallel to each other and are arranged at intervals; each connecting sheet is connected between the two fixing sheets vertically; the two fixing sheets are L-shaped; an L-shaped receiving space is formed by the two fixing sheets and each connecting sheet; the bending angle of each receiving space corresponds to the needed bending angle of one flexible circuit board; each receiving space is used for accommodating the side edges of the two fixing plates adjacent to each other at the joint part, so as to enable the angle formed between the two fixing plates matched with the two fixing pieces to be the same with the bending angle of each receiving space; and the flexible circuit boards are correspondingly bonded to the two fixing plates corresponding to the bending angles of the flexible circuit boards. Each connector is connected with the two flexible circuit boards that need to be connected. The invention also provides a manufacturing method for the circuit board die set.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board module and a manufacturing method thereof. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Due to its small thickness and flexibility, the flexible circuit board is widely used in electronic equipment. As the functions of electronic devices continue to increase, the number of circuit boards installed in electronic devices also tends to increase. When multiple flexible circuit boards need to be installed in an electronic device, usually the flexible circuit boards need to be ...
Claims
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IPC IPC(8): H05K1/00H05K3/00H05K7/00
Inventor 马文峰
Owner AVARY HLDG (SHENZHEN) CO LTD