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Die-free and direct-writing preparation method for three-dimensional structure of ceramic substrate and ceramic substrate photosensitive slurry

A three-dimensional structure, ceramic-based technology, applied in the field of ceramic-based photosensitive paste for preparation, can solve the problems of complex preparation process, high requirements for preparation and rheological properties, etc., achieve simple preparation, low rheological requirements, avoid fracture or collapsing effect

Inactive Publication Date: 2012-08-01
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has high requirements on the preparation and rheological properties of the slurry, and the preparation process is complicated, which is a major problem in the moldless molding technology.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1: Preparation of BaTiO 3 Ceramic-based three-dimensional wood stack structure.

[0019] 1. Preparation of ceramic-based photosensitive paste:

[0020] Using methyl methacrylate as a monomer and pentaerythritol triacrylate as a crosslinking agent to prepare a mixed solution (that is, the main body of photosensitive adhesive), the mixed solution is an oil-soluble solution, and the mass percentage of methyl methacrylate is 25%; then add photoinitiator 2,2-diethoxyacetophenone and benzil to the mixed solution, and keep stirring until clarified to obtain a photosensitive adhesive, which is stored at low temperature and protected from light for later use; among them, the photoinitiator It accounts for 3% (mass) of the photosensitive adhesive, and benzil accounts for 3% (mass) of the photosensitive adhesive;

[0021] Gradually add BaTiO with a particle diameter of about 100 nm to the above photosensitive adhesive 3 Nano powder, stir evenly to get BaTiO 3 Ceramic-b...

Embodiment 2

[0026] Embodiment two: preparation TiO 2 Ceramic-based three-dimensional wood stack structure.

[0027] 1. Preparation of ceramic-based photosensitive paste:

[0028] Prepare a mixed solution of methyl methacrylate and pentaerythritol triacrylate, wherein the mass percentage of methyl methacrylate is 35%, then add photoinitiator 2,2-diethoxybenzene in the mixed solution Ethyl ketone and benzil, continuously stirred until clarified to obtain a photosensitive adhesive, stored at low temperature and protected from light for use; wherein, the photoinitiator accounts for 2% (mass) of the photosensitive adhesive, and benzil accounts for 2% (mass) of the photosensitive adhesive;

[0029] Add TiO with a particle diameter of about 21 nm to the above photosensitive adhesive 2 powder, among them, TiO 2 The mass ratio of powder to photosensitive adhesive is 3:1, stir evenly to obtain TiO 2 Ceramic-based photosensitive paste.

[0030] 2. Photocuring assisted molding: the prepared TiO ...

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Abstract

The invention provides a die-free and direct-writing preparation method for a three-dimensional structure of a ceramic substrate. The die-free and direct-writing preparation method comprises the following steps of: forming the three-dimensional structure by utilizing slurry and slurry direct-writing forming equipment, wherein the slurry is ceramic substrate photosensitive slurry; and irradiating a formed part by ultraviolet and performing thermal treatment on the formed part at the temperature of 100-600 DEG C for 1 to 2 hours during forming. The invention also provides the ceramic substrate photosensitive slurry which is used for preparing the three-dimensional structure of the ceramic substrate in a die-free and direct-writing manner and comprises the following components in percentage by volume: 35 to 75 percent of ceramic powder of which the particle size is 20 nm-2 mu_m and 25 to 65 percent of photoelectric glue. According to the preparation method, the formed part can be solidified at a high speed, and a phenomenon that the formed structure is broken or collapsed is avoided; and the slurry is easy to prepare.

Description

technical field [0001] The invention relates to the preparation of a three-dimensional ceramic structure, in particular to a method for preparing a ceramic-based three-dimensional structure by direct writing of a slurry, and a ceramic-based photosensitive slurry for the preparation. Background technique [0002] Slurry direct writing 3D molding technology uses air pressure as the power to extrude raw materials, and the designed structure is obtained by controlling the slurry direct writing molding equipment layer by layer through computer programs. It is a combination of computer-aided design, precision machinery and material science. The integrated method can be used for the processing of polymers, functional ceramics and some soft materials (such as paraffin), and is a new method for preparing three-dimensional microstructures in recent years. Especially in the preparation of functional ceramic devices, it has the characteristics of fast molding speed and short manufacturi...

Claims

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Application Information

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IPC IPC(8): C04B35/622C04B35/46
Inventor 李勃孙竞博蔡坤鹏周济李龙土彭琴梅张晓龙苏水源
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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