Tunneling field effect transistor with multi-doping pocket structure and manufacturing method for tunneling field effect transistor
A tunneling field effect and transistor technology, which is applied in semiconductor/solid-state device manufacturing, diodes, semiconductor devices, etc., can solve the problems of increasing the difficulty of device realization, optimize device performance, reduce tunneling barrier, and reduce subthreshold slope Effect
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[0040] Fig. 2 is an embodiment of the manufacturing method of the Tunneling Field Effect Transistor disclosed in the present invention, wherein Fig. 2 (a) is a sectional view of the device along the channel length direction, Fig. 2 (b) is a top view of the device, Fig. 2 (c) is a cross-sectional view of the device along the AA' direction in Fig. 2(b). The device has three electrodes in total: a drain electrode 210, a gate electrode 211 and a source electrode 212, which is a three-terminal device. The device includes a source region 203, a drain region 208, a gate stack region, a first doped pocket 204, a second doped pocket 205, a third doped pocket 202, a substrate 201, and a second insulating layer 209, on the semiconductor substrate On the bottom 201 , between the source region 203 and the drain region 208 , a channel region 213 is formed by removing the region outside the first doped pocket 204 and the second doped pocket 205 . Wherein, the gate stack region includes a fi...
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