Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Tunneling field-effect transistor and manufacturing method thereof

A tunneling field effect and transistor technology, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of increased leakage current and reduced driving current of tunneling transistors, and achieves reduced leakage current and improved driving current , the effect of alignment requirement reduction

Inactive Publication Date: 2010-07-14
FUDAN UNIV
View PDF0 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while the leakage current is reduced, the driving current of the tunneling field effect transistor is also reduced. Therefore, the tunneling field effect transistor is still facing the challenge of how to increase the driving current.
[0004] Although the leakage current of the tunneling field effect transistor is lower than that of the traditional MOS tube, the leakage current of the tunneling transistor also increases with the shortening of the channel.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tunneling field-effect transistor and manufacturing method thereof
  • Tunneling field-effect transistor and manufacturing method thereof
  • Tunneling field-effect transistor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0062] figure 2 It is an embodiment of the semiconductor recessed channel tunneling device disclosed in the present invention, and it is a cross-sectional view along the channel length direction of the device. The device has a gate stack region, a source region, a drain region and a substrate region. The gate stack region is composed of insulating layer 205 , insulating layer 206 , conductive layer 207 and conductive layer 212 . The insulating layer 205 is silicon dioxide grown or deposited by thermal oxidation. The insulating layer 206 is a high dielectric constant medium. The conductive layer 207 is polysilicon, and the conductive layer 212 is a metal layer. The sidewall 208 of the gate stack region is an insulator such as Si 3 N 4 materials that insulate the gate region conductor layer from other conductor layers of the device. The doping type of the source doped region 211 is generally opposite to that of the drain doped region 204 , and is generally the same as tha...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of the semiconductor device, and particularly relates to a tunneling field-effect transistor and a manufacturing method thereof. The transistor comprises a source electrode, a drain electrode, a grid electrode and a substrate. The channel of the semiconductor device is indented towards the inside of the substrate, so as to reduce the leakage current and simultaneously drive the current to rise. The invention also discloses a manufacturing method of the semiconductor device. The semiconductor device manufactured by the invention has the advantages of low leakage current, high driving current, high degree of automation and the like. The invention can reduce the static power consumption of the integrated circuit and improve the integrated level thereof.

Description

technical field [0001] The invention belongs to the technical field of semiconductor devices, and in particular relates to a low power consumption tunneling field effect transistor using a recessed channel and a manufacturing method of the device. Background technique [0002] Metal-oxide-silicon field-effect transistors (MOSFETs) are widely used in various electronic products. With the development of integrated circuit technology, the size of MOSFET is getting smaller and smaller, and the density of transistors on the unit array is getting higher and higher. The ensuing short channel effect is also more obvious. How to reduce the power consumption of portable devices has become a research hotspot in the field of semiconductor technology. Today's integrated circuit device technology node is already at about 50nm, and the leakage current between the source and drain of MOSFETs increases rapidly as the channel length shrinks. Especially when the channel length drops below 3...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/10H01L29/49H01L21/336H01L27/088
Inventor 王鹏飞臧松干孙清清张卫
Owner FUDAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products