Flexible electronic device and manufacturing method thereof
A technology of electronic devices and manufacturing methods, which is applied in the directions of circuits, electrical components, transportation and packaging, etc., and can solve problems such as non-uniform thickness of soft substrates
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[0032] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, it is that these embodiments are provided so that this disclosure will be thorough, complete and fully convey the scope of the invention to those skilled in the art. The same reference numerals represent the same elements throughout.
[0033] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being "directly on" another element, no intervening elements are present. As used herein, the terms "and / or" include any and all combinations of one or more of the associated listed items.
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