Backlight module and method for preparing circuit board with paraposition patterns
A technology for aligning patterns and backlight modules, which is applied in the formation of conductive patterns, optics, light guides, etc., and can solve the problem that backlight modules cannot provide uniformly distributed light sources.
Inactive Publication Date: 2012-08-15
AU OPTRONICS CORP
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Problems solved by technology
[0003] However, in the existing backlight module, if the circuit board provided with the light emitting diode elements is arranged above the light guide plate, the light emitting diode elements will be blocked by the circuit board when assembling the backlight module, and the light emitting diode elements cannot be visually recognized. Whether the position of the microstructure of the component and the light guide plate is accurately aligned, if the position of the two is not accurately aligned, the backlight module will not be able to provide a uniformly distributed light source
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[0032] In order to enable those who are familiar with the technical field of the present invention to further understand the present invention, the preferred embodiments of the present invention are listed below, together with the attached drawings, to describe in detail the composition of the present invention and the desired effects .
[0033] Please refer to figure 1 and image 3 . Figure 1 to Figure 3 A schematic diagram illustrating a method for manufacturing a circuit board with an alignment pattern according to a preferred embodiment of the present invention, wherein figure 1 and figure 2 is shown in section, and image 3 Shown in top view. Such as figure 1 As shown, first, a substrate 10 is provided. Next, a circuit layer 11 is formed on the substrate 10 . The circuit layer 11 is a film layer with conductive properties, such as a metal layer, but not limited thereto. Next, a first area 1 and a second area 2 are defined on the circuit layer 11, wherein the ...
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The present invention relates to a backlight module and a method for manufacturing a circuit board with paraposition patterns. The backlight module comprises a back frame, a light guide plate and at least one light emitting assembly. The light guide plate is equipped in the back frame, wherein the light guide plate is provided with a first side, a second side and a light incoming surface. Furthermore the first side and the second side are interconnected. The light emitting assembly is equipped in the back frame. Furthermore the light emitting assembly comprises a circuit board and at least one light emitting component. The light emitting component faces the light incoming surface of the light guide plate. Furthermore the circuit board is partially overlapped with the light guide plate. Furthermore the circuit board is provided with a paraposition pattern and a conductive circuit. The paraposition pattern is aligned with at least one in the first side and the second side of the light guide plate. Furthermore the conductive circuit is electrically connected with the light emitting component. The backlight module improves uniformity of the light source of the backlight module.
Description
technical field [0001] The invention relates to a backlight module and a method for making a circuit board with an alignment pattern, in particular to a backlight module that utilizes the alignment pattern on the circuit board and a light guide plate for alignment. Background technique [0002] The LCD panel itself does not have the ability to emit light, and it needs to rely on the light source of the backlight module to make the LCD panel display images normally. Due to the characteristics of small size, long life, low power consumption, short response time and strong shock resistance of LED elements, current backlight modules have widely used LED elements to provide light sources. The light source provided by the light-emitting diode element is a point light source, so the light incident surface of the light guide plate must be provided with microstructures, and the position of the light-emitting diode element must be accurately aligned with the microstructure of the ligh...
Claims
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IPC IPC(8): F21S8/00F21V8/00G02F1/13357H05K3/10F21Y101/02
Inventor 蔡瑞鸿林诗尧
Owner AU OPTRONICS CORP