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Winding arrangement for an inductive component

A winding arrangement and device technology, applied in the direction of transformer/inductor coil/winding/connection, transformer/inductor cooling, transformer/inductor parts, etc., can solve problems such as not optimal shape, achieve enhanced cooling effect, The effect of size optimization

Inactive Publication Date: 2012-08-22
亚尔科·萨洛迈基
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is not the best shape for size minimization

Method used

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  • Winding arrangement for an inductive component
  • Winding arrangement for an inductive component
  • Winding arrangement for an inductive component

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Embodiment Construction

[0031] The winding structure according to the invention relates in particular to high-power planar windings, which are also referred to as "laminated windings". The essential point of the invention is that the winding consisting of sheet-like planar winding elements is provided with a cooling medium which transfers excess heat away from the winding. According to the invention, the cooling medium, which can be a gas or a liquid, is located between the winding layers consisting of one or more winding sheets. The cooling medium can also be a solid substance on the surface of the winding sheet, or when the cooling substance is inside the winding sheet, the cooling medium can be the winding sheet itself.

[0032] In showing the first embodiment of the present invention figure 2 , the winding layers 2 of the winding 1 consisting of planar winding sheets have spaces 3 (such as gaps) between these winding layers where air is blown, for example by means of a fan, so that the moving a...

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PUM

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Abstract

The scope of the invention is a winding arrangement for an inductive component that consists at least of a core (9) and of a winding structure placed around the core and consisting of planar winding sheets (11). Inside the winding structure there is cooling medium that is adapted to transfer excess heat away from the winding.

Description

technical field [0001] The invention relates to a winding arrangement for an inductive component according to variant 1 . Background technique [0002] The inductance device consists of at least a winding and an iron core. In order to reduce the size of power electronic devices, it is highly desirable that the size of the winding of the inductive device be as compact as possible. In high-frequency low-power switching power supplies, so-called planar windings are used to meet high power density requirements. The windings are constructed from substantially planar elements. Such windings may be fabricated such as by utilizing printed circuit board layers, by laminating and soldering stamped copper components, or by folding a flexible printed circuit board such as a Kapton based laminate. A disadvantage of these known planar winding techniques is that they are not suitable for high current applications due to manufacturing process and cooling capacity constraints. For these ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/08
CPCH01F27/2847H01F27/2876Y10T29/49071H01F27/08H01F27/28
Inventor 亚尔科·萨洛迈基
Owner 亚尔科·萨洛迈基