Novel double-interface intelligent card module

A dual-interface smart card, a new type of technology, applied to record carriers, instruments, computer parts, etc. used in machines, can solve the problems of time-consuming, high production costs, high material costs, affecting products, etc., to reduce production costs, save production materials, The effect of improving production efficiency

Inactive Publication Date: 2012-09-12
上海祯显电子科技有限公司
View PDF0 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing dual-interface financial card production process is relatively complicated. It needs to produce smart card modules first, and then add external coils. The welding process is the most complicated and affects product performance. It is time-consuming, poor in reliability, and high in production costs and material costs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel double-interface intelligent card module
  • Novel double-interface intelligent card module
  • Novel double-interface intelligent card module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0036] The present invention aims at problems such as high energy consumption, cumbersome manufacturing process, and relatively poor reliability in use of the existing dual-interface financial card production process, and the implementation of the technical solution provided is as follows:

[0037] see figure 2 , a module provided by the present invention, the chip surface mount pad 111 is arranged on the carrier tape, and the pad is arranged in the middle of the carrier tape, which can mount a chip according to actual needs.

[0038] According to the function of the financial card, the chip surface mount pad 111 of the carrier tape can be soldered with a contact chip, a non-contact chip or a dual-interface chip.

[0039] In order to combine t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a novel double-interface intelligent card module which is formed by a carrier tape (1), a double-interface intelligent card chip (2) and a matching circuit (3). A solder side of the carrier tape is provided with multi-circle surrounded radio frequency antennas and a part welding plate. The welding plate and a corresponding contact surface carry out electrical connection through a blind hole. The contact surface of the carrier tape is provided with eight conductive contacts which are mutually electrically independent with each other. The size of the contact accords with a dimension requirement ruled by ISO7816. The double-interface intelligent card chip is performed on a packaging processing and is suitable for a surface mounting technology to carry out welding. The matching circuit is a resonance matching circuit formed by one or two miniature surface mounting capacitors. The chip and the capacitor adopt the surface mounting technology so as to achieve once welded forming. The intelligent card produced by using the double-interface intelligent card module of the invention is directly used in a contact environment and a non-contact environment. Product performance can be increased and simultaneously most of production equipment and technology can be used so that production cost can be reduced and a production period can be shortened.

Description

technical field [0001] The invention relates to a smart card module, in particular to a module for double-interface smart card packaging, which is suitable for application in the field of smart card packaging. Background technique [0002] In the field of smart card packaging, the packaging volume of smart cards is very large. At present, the smart card industry is developing towards technological innovation. New technologies are constantly emerging, new functions are increasing, and many old functions are constantly being improved and strengthened. In the future, new smart card service applications will continue to expand. In these developments At the same time, the improvement of the function and performance of the smart card is inevitable. [0003] At the stage when China was vigorously inventing the secure transfer of financial cards, contact financial cards in the form of CPUs and dual-interface financial cards with both contact and non-contact functions appeared. How...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 陆红梅
Owner 上海祯显电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap