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Ultrasonic machining device and machining method for diamond microporous wire-drawing die

An ultrasonic processing and diamond technology, applied in the field of ultrasonic processing devices, can solve the problems of easy folding needles, folding needles, high difficulty and the like

Active Publication Date: 2012-09-19
北京迪蒙吉意超硬材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For molds with smaller apertures, due to the small size of the tool pins, it is more difficult to adjust the tool pins and the mold to be processed relative to the rotary table. During the dynamic adjustment process, it is easy to break the pins.
[0006] Therefore, the processing method of mold floating and centering can still be used barely for the wire drawing die with an aperture of about 0.05mm, but for the diamond microporous wire drawing die with an aperture of ≤0.03mm, because the tip of the tool needle is too thin, it is difficult to find and press in the center. During the adjustment process, the problem of easy broken needles becomes an unavoidable obstacle
During the operation, frequent needle folding will make the processing impossible
In the prior art, there are no other better solutions

Method used

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  • Ultrasonic machining device and machining method for diamond microporous wire-drawing die
  • Ultrasonic machining device and machining method for diamond microporous wire-drawing die
  • Ultrasonic machining device and machining method for diamond microporous wire-drawing die

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Embodiment Construction

[0042] In order to effectively solve the problem of frequent needle folding in the prior art when processing diamond micro-hole wire drawing dies, especially when processing diamond micro-hole wire drawing dies with an aperture ≤ 0.03 mm. The invention provides an ultrasonic machining device for aligning the machining center of the machining area by means of an observation / detection / correction system when grinding and polishing the diamond microhole wire drawing die.

[0043] Such as figure 1 The ultrasonic processing device shown includes a device base 1 , a rotating motor 2 fixedly installed above the device base 1 , a rotary table 3 and a device column 4 . The rotary motor 2 is connected to the rotary table 3 by belts or chains, and the rotary motor 2 is used to drive the rotary table 3 to rotate. The rotary table 3 is used to fix the diamond microhole wire drawing die (hereinafter referred to as the die) to be processed, and drive the die to rotate. A mold centering mech...

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Abstract

The invention discloses an ultrasonic machining device and a machining method for a diamond microporous wire-drawing die, aiming at the problem of frequent needle breakage during machining for a diamond microporous wire-drawing die in the prior art. The ultrasonic machining device mainly comprises a three-dimensional tool needle adjustment mechanism, a die alignment mechanism, and an observation / detection / correction system, wherein a tool needle and the die can be aligned respectively by taking the centre of a rotary workbench as the reference of the alignment operation and by virtue of the observation / detection / correction system. In addition, the ultrasonic machining device can provide a balanced machining pressure by combining with a balanced elastic pressure adjustment mechanism, so that the occurrence of frequent needle breakage during a machining process for the diamond microporous wire-drawing die can be avoided; the ultrasonic machining device is especially suitable for machining the diamond microporous wire-drawing die with the pore diameter of not greater than 0.03 mm, and capable of improving the machining stability and the reliability, thus ensuring the machining quality of the diamond microporous wire-drawing die and increasing the machining efficiency of the diamond microporous wire-drawing die.

Description

technical field [0001] The invention relates to an ultrasonic processing device, in particular to an ultrasonic processing device suitable for processing diamond micro-hole wire drawing dies, and also relates to a processing method using the device to realize grinding and polishing of diamond micro-hole wire drawing dies, which belongs to special processing technology field. Background technique [0002] Wire drawing is a metal processing method that forces the metal to pass through the mold under the action of external force, the metal cross-section is compressed, and the required cross-sectional shape and size are obtained. A wire drawing die is a tool that changes the shape and size of the metal cross section. The hole shape of the wire drawing die is composed of entrance, lubrication, compression, sizing, reverse taper, exit and other areas with different angles and tapers, which is relatively complicated. The diameter of the wire drawing die, the precision of the hole...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04
Inventor 黄建宇曹凤国胡绛梅
Owner 北京迪蒙吉意超硬材料技术有限公司
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