Placing rack of plastic packaged molded products of QFN (Quad Flat No-lead) process

Abstract

The invention provides a placing rack of plastic packaged molded products of a QFN (Quad Flat No-lead) process. The placing rack reduces the possibility of large wounding loss of the products caused by static electricity generated due to friction, improves the production yield and avoids edge warpping and non-uniform heaving of plastic packaged rubber mass, improves the cutting and separating speed, improves the production efficiency, and enhances the service life of a cutter, so as to reduce the production cost. The placing rack comprises a frame, and is characterized by further comprising a material pressing plate, a positioning shaft and a fastening bolt. The frame comprises placing grooves symmetrical on both sides. Support plates are arranged at the bottoms of the placing grooves. Positioning holes are arranged on vertical surfaces of the placing grooves which are arranged oppositely to each other. One sides of the placing grooves are connected with each other through a connecting plate with a radiating hole while the other ends of the placing grooves are hollow in the middle. The plastic packaged molded products are superposed in a trough formed by the connecting plate and the two placing grooves. The bottom of each plastic packaged molded product is supported orderly on the top surface of the plastic packaged molded product below.

Description

technical field [0001] The invention relates to the technical field of QFN packaging, in particular to a discharge rack for plastic-encapsulated products of the QFN process. Background technique [0002] The existing QFN molded products are all placed in plastic or stainless steel boxes, that is, the rectangular QFN molded products are placed in plastic or stainless steel boxes. Since there is no special fixing device, QFN products are in the process of handling. They will shake each other, rub against each other, generate static electricity, and cause electrical performance damage to the product. At the same time, after the QFN product is molded and packaged, because the internal stress of the product has not been completely eliminated, the molded product will slowly warp during the placement process, and the plastic package will be uneven. The bulge will bring inaccurate positioning to the subsequent cutting and separation process, slow cutting speed, and even damage t...

AI Technical Summary

Problems solved by technology

[0002] The existing QFN molded products are all placed in plastic or stainless steel boxes, that is, the rectangular QFN molded products are placed in plastic or stainless steel boxes. Since there is no special fixing device, QFN products are in the process of handling. They will shake each other, rub against each other, generate static electricity, and cause electrical performance damage to the product. At the same time, after the QFN product is molded and packaged, because the internal stress of the product has not been completely eliminated, the molded product will slowly warp during the placement process, and the plastic package will be uneven. The bulge will bring inaccurate positioning to the subsequent cutting and separation process, the cutting speed will be slow, and even the scribing knife will be damaged, and the production cost will be high.

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