Adhesive tape for temporary fixing of electronic part
A technology for temporarily fixing electronic components, applied in the direction of non-polymer adhesive additives, electrical components, adhesive types, etc., which can solve problems such as failure to obtain sufficient antistatic effect, short circuit of electronic components, low yield, etc.
Inactive Publication Date: 2012-09-19
NITTO DENKO CORP
View PDF6 Cites 7 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, as described in Patent Document 1, by adding materials having an antistatic effect such as conventional general surfactants, conductive fillers, carbon black, and quaternary ammonium acrylic copolymers to the adhesive, Insufficient antistatic effect at heat peeling
In this case, when the electronic components are peeled off by heating and recycled, there is a possibility that the electronic components may short-circuit, resulting in an extremely low yield, and improvement is desired.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0143] Uniformly mix and dissolve 1.0 parts of epoxy-based cross-linking agent in 100 parts of copolymer polymer formed from ethyl acrylate-2-ethylhexyl acrylate-acrylic acid (60 parts-40 parts-3 parts). Joint agent, 5 parts of 1-butyl-3-methylpyridinium imide (manufactured by Japan Carlit Co., Ltd., trade name: CIL-312) as a static elimination agent, 15 parts of rosin phenol-based adhesive A coating solution obtained by applying an agent, 30 parts of thermally expandable microspheres of a 150° C. foaming expansion type (manufactured by Matsumoto Yushi Yuba, Matsumoto Microsphere F-80SD), and toluene was coated on a support substrate (PET#100) and dried. The thickness after drying was made into 50 micrometers, and the adhesive tape 1 for temporary fixing of electronic components was obtained.
Embodiment 2
[0145] Except having added 0.1 part of antistatic agents, it carried out similarly to the said Example 1, and the sheet|seat 2 was obtained.
Embodiment 3
[0147] Except having added 10 parts of antistatic agents, it carried out similarly to the said Example 1, and the sheet|seat 3 was obtained.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| peel strength | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to an adhesive tape for temporary fixing of an electronic part. In the production process of electronic parts, since a surface resistance value is too much increased after heat foaming of a pressure-sensitive adhesive layer, static electricity is easily accumulated in electronic parts, and the static electricity has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is below 1.0 * 10 13 ohmm; and the ratio of the surface resistance after heating for foaming to that before the heating is below 5.0.
Description
technical field [0001] The present invention relates to an adhesive tape for fixing electronic components with antistatic properties, and in particular to an adhesive tape for temporary fixing with antistatic properties used in the production of electric, electronic and semiconductor components. Background technique [0002] Adhesive tapes for the purpose of fixing and protecting components in the production process when producing electric, electronic components, and semiconductor components have been known so far. As such an adhesive tape, there is an adhesive tape provided with a re-peelable acrylic adhesive layer on the base film, which has a strong resistance to external force when pasted and can be removed from the substrate by heating when peeling. Adhesive tapes with heat-expandable adhesive layers that release naturally. [0003] The adhesive tape is peeled off at the end of the predetermined treatment process, and static electricity is generated at the peeled inter...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J7/38
CPCH01L21/6836C09J133/02C08K9/10H01L2221/68327C09J2205/11C09J9/00C09J2205/102C09J7/0207C09J133/00C08K5/0075C09J2203/326C09J2433/00C09J11/06C08L2312/00C09J7/38Y10T428/28C09J2301/412C09J2301/408C09J7/29C09J7/403C09J7/21H01L21/02002C09J2301/312
Inventor 副岛和树下川大辅平山高正
Owner NITTO DENKO CORP