Inkjet head

Abstract

Disclosed is an inkjet head with a harmonica-type head tip, wherein the inkjet head is configured in a manner such that wires electrically connected to the drive electrodes within channels can be led rearward as is from the rear surface of the head tip, can be reduced in thickness even if the head tip has a plurality of channel rows arranged in parallel, and has excellent productivity. The inkjet head is characterized in that a groove is provided following the array direction of the aforementioned channels in areas on the rear surface of the head tip in which the channels have not been formed; a lead-out electrode, which is electrically connected to the aforementioned drive electrodes, is formed from the rear surface of the aforementioned head tip to the interior of the aforementioned groove; one end of a wiring member, which comprises connecting wires upon an insulating material that correspond to the aforementioned lead-out electrode, is inserted within the aforementioned groove; and the aforementioned drive electrodes are electrically connected to the aforementioned connecting wires via the aforementioned lead-out electrode as a result of the electrical connection of the aforementioned connecting wires within said groove to the aforementioned lead-out electrode.

Description

technical field [0001] The present invention relates to an ink jet head, and more specifically, to an ink jet head having an improved electrode extraction structure of a so-called harmonica head chip. Background technique [0002] Conventionally, there is known an ink jet head in which the openings of the channels are arranged on the front and rear surfaces of a shear mode type head chip to form a so-called harmonica head chip (Patent Documents 1 and 2). The chip is to cut a plurality of channels in parallel on the piezoelectric element substrate, and form driving electrodes on the driving walls that distinguish the channels. By applying a voltage to the driving electrodes, the driving walls are sheared and deformed, so that the ink in the channels is removed from The nozzles provided on the front surface spray out. [0003] Since such a harmonica head chip applies a drive signal to the drive electrodes in each channel, it is difficult to electrically connect the drive elec...

AI Technical Summary

Problems solved by technology

[0010] However, in the technique described in Patent Document 1, it is difficult to configure a head chip having three or more channel rows because the extraction electrodes drawn from the channels of the two channel rows are separately formed on the upper surface and the lower surface of the head chip.

[0011] On the other hand, although the technique described in Patent Document 2 can constitute a head chip having four channel rows, it is difficult to lead wiring corresponding to three or more channel rows in the same direction of the head chip, and it is difficult to apply to a head chip having four or more channel rows. In the head chip with more than five channel columns

[0012] An inkjet head having five or more channel columns may also be configured by arranging a plurality of head chips described in Patent Documents 1 and 2 in parallel. However, in this case, the wiring drawn from each channel to the outside of the head chip It is relatively obstructive, and the intervals between the head chips cannot be closely arranged side by side.

Although the inkjet head is required to be thin in the scanning direction, there is a problem that it is difficult to reduce the thickness of a head chip having a plurality of channel rows because the head chips cannot be closely arranged side by side.

[0013] Moreover, for the harmonica-type head chip, it has the advantage of being able to manufacture a large number of head chip products of the same shape by completely cutting from a large channel substrate arranged side by side in the channel row, but in the parallel arrangement described in Patent Documents 1 and 2 In the case of installing multiple head chips, after wiring is connected to each head chip formed by two to four channel columns, multiple head chips with wiring must be arranged side by side, so it is not possible to transfer from a large channel substrate at one time. Complete dicing to obtain a head chip with more than five channel columns also has a problem of deterioration in productivity

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