Light emitting diode package structure
A light-emitting diode and packaging structure technology, applied to semiconductor devices, electrical components, circuits, etc., can solve the problems affecting the heat dissipation efficiency of the light-emitting diode packaging structure 1, and it is not easy to dissipate heat, so as to achieve the effect of increasing heat dissipation efficiency and shortening the path
Active Publication Date: 2012-09-26
LEXTAR ELECTRONICS CORP
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- Abstract
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- Application Information
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Problems solved by technology
However, the part of the heat-conducting component 20 between the reflection groove 13 and the soldering surface 12 is embedded in the insulating body 10. Therefore, the aforementioned part embedded in the insulating body 10 is not easy to dissipate heat, thereby affecting the packaging structure of the LED. 1 cooling efficiency
Method used
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Embodiment Construction
[0066] see Figure 2 to Figure 4 , figure 2 is a perspective view of the light emitting diode packaging structure 2 of the present invention, image 3 and Figure 4 It is a partial exploded view of the LED packaging structure 2 of the present invention.
[0067] The LED packaging structure 2 includes an insulating body 100 , a heat conduction unit 200 , a conduction unit 300 , and a light emitting diode 400 . The insulating body 100 can be made of plastic material, such as polyphthalamide (PPA) plastic. The insulating body 100 is provided with a light-emitting surface 101, a welding surface 102, two side surfaces 103, and a mounting surface 104, wherein the light-emitting surface 101 is adjacent to the welding surface 102 and the side surface 103, and the light-emitting surface 101 and the mounting surface 104 are respectively arranged on the insulating body 100. opposite sides of the . The insulating body 100 includes a reflective cover 110 and a base 120 . In another ...
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The invention provides a light emitting diode package structure, comprising an insulator body, a heat conductive unit and a light emitting diode. The heat conductive unit comprises a conductive portion and a reflective portion. The conductive portion is arranged in the insulator body and is exposed to the accommodating tank of the insulator body. The reflective portion is connected to the conductive portion and traverses through the side wall of the accommodating tank. The light emitting diode is arranged at the conductive portion and is positioned in the accommodating tank. Heat generated by the light emitting diode is conducted to the reflective portion through the conductive portion, and light generated by the light emitting diode can be reflected through the side wall of the accommodating tank and the reflective portion. According to the light emitting diode package structure provided in the invention, the side wall of the accommodating tank prepared from plastic is substituted by the reflective portion prepared from metal, thereby high brightness of the light emitting diode package structure is maintained after long-term usage.
Description
technical field [0001] The invention relates to a packaging structure, and in particular to a light emitting diode packaging structure. Background technique [0002] Due to the advantages of low energy consumption, long life, and small size, LEDs have been widely used in various lighting applications. see figure 1 , is a perspective view of a conventional light emitting diode packaging structure 1 . The LED packaging structure 1 includes an insulating body 10 , a heat-conducting component 20 , an electrode 30 , and a LED 40 . [0003] The insulating body 10 has a light emitting surface 11 and a welding surface 12 . A reflection groove 13 is recessed on the light emitting surface 11 . The heat conduction component 20 and the electrode 30 are disposed on the insulating body 10 and exposed on the reflection groove 13 and the welding surface 12 respectively. The light emitting diode 40 is disposed on the electrode 30 and located in the reflection groove 13 . The light gene...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L33/48H01L33/60H01L33/64
CPCH01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00014
Inventor 蔡培崧林子朴梁建钦王君伟
Owner LEXTAR ELECTRONICS CORP