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Anti-overload MEMS (Micro Electro Mechanical Systems) device with three-dimensional stop structure and machining method thereof

A stopper structure and processing method technology, applied in the field of micromachining technology, can solve problems such as inability to process stoppers, and achieve the effects of enhanced reliability and safety, low cost, and simple process

Active Publication Date: 2015-06-17
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a MEMS device with a three-dimensional stopper structure and a processing method thereof. The MEMS device can resist the problem of overloading in the three-dimensional direction, thereby improving the reliability and safety of the device. The processing of the device The method solves the problem that the Z-direction stop cannot be processed by the conventional process, and compared with the ordinary process without a stop, only a part of the process is added, which has no effect on the difficulty of the overall process, and the processing is convenient and easy

Method used

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  • Anti-overload MEMS (Micro Electro Mechanical Systems) device with three-dimensional stop structure and machining method thereof
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  • Anti-overload MEMS (Micro Electro Mechanical Systems) device with three-dimensional stop structure and machining method thereof

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Embodiment Construction

[0028] According to the attached figure 1 It can be seen that the present invention specifically relates to a MEMS device with a three-dimensional stop structure, including a base 1, a cap 8 and a structure layer 4 located between the base 1 and the cap 8. The base 1, the cap 8 are peripherally contacted and bonded, so The structure layer 4 includes a movable structure 5 and a structure layer stop 6 located at the periphery of the movable structure 5 and restricting the movement of the movable structure 5 in the XY direction. The structure layer stop 6 is fixed on the fixed structure 10 around the structure layer 4. The innovation of the present invention is: a cavity is provided on the upper surface of the base 1 at a position corresponding to the movable structure 5, a base stop 2 is provided in the cavity, and the lower surface of the cap 8 is at a position corresponding to the movable structure 5. A cavity is provided, and a cap stop 9 is arranged in the cavity. The base st...

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Abstract

The invention discloses an anti-overload MEMS (Micro Electro Mechanical Systems) device with a three-dimensional stop structure and a machining method thereof, belonging to the technical field of micromachining technologies. The MEMS device comprises a base, a cap and a structural layer between the base and the cap, wherein the peripheries of the base and the structural layer as well as the peripheries of the cap and the structural layer are bonded, a cavity is arranged on the upper surface of the base in a position corresponding to a moving structure, a base stop is arranged in the cavity, a cavity is arranged on the lower surface of the cap in a position corresponding to the moving structure, and a cap stop is arranged in the cavity. Machining is completed by etching shallow cavities and deep cavities on the base and the cap, manufacturing the Z-direction stop and bonding. According to the invention, the Z-direction stop structure is added, a technological process is simple and low in cost, batch production can be realized, in addition, the three-dimensional anti-overload property of the MEMS device is effectively increased, and the reliability and the safety of the MEMS device are enhanced.

Description

Technical field [0001] The invention relates to a MEMS device and a processing method thereof, in particular to a processing method of a three-dimensional stop structure for a MEMS device, belonging to the technical field of micro-mechanical processing technology. Background technique [0002] Micro-machining technology is developed on the basis of semiconductor IC (Integrated Circuit, integrated circuit) technology. Unlike IC products, MEMS (Micro Electro Mechanical System) devices are mostly three-dimensional structures, and many MEMS devices have movable structures, such as accelerometers and gyroscopes. For MEMS devices with movable structures, if the application encounters harsh environments such as shock and vibration, which exceed the device's tolerance, "overload" will occur, which may cause the active structure to break and cause failure, thereby affecting the device And even the overall reliability of the system. [0003] Adding a stop structure is an effective method t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00B81C3/00
Inventor 杨拥军徐淑静李博何洪涛
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP